Reference health

Autonomic Restoration of Electrical Conductivity

https://doi.org/10.1002/adma.201102888

25/25 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

1 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 25 checked references that resolve

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Three-dimensional silicon integration

resolves10.1007/BF02692443

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resolves10.1016/j.pmatsci.2010.01.001

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

resolves10.1098/rsif.2006.0202

Towards electrically conductive, self-healing materials

resolves10.1039/b910673a

Microcapsules containing suspensions of carbon nanotubes

resolves10.1002/adfm.201000159

Restoration of Conductivity with TTF‐TCNQ Charge‐Transfer Salts

resolves10.1147/JRD.2008.5388568

Thermomechanical modeling of 3D electronic packages

resolves10.1080/00986440801930302

THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATION, PROCESSING, AND THERMOMECHANICAL MODELING

resolves10.1038/nature07110

Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates

resolves10.1016/S0013-7944(98)00052-6

Adhesion and debonding of multi-layer thin film structures

resolves10.1088/0022-3727/44/3/034004

Adhesion–delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

resolves10.1016/S0020-7683(01)00235-9

Cracking in thin multi-layers with finite-width and periodic architectures

resolves10.1016/S0022-5096(99)00081-2

Crack patterns in thin films

resolves10.1109/24.406565

Popcorning: a failure mechanism in plastic-encapsulated microcircuits

resolves10.1063/1.347525

A stress-induced diffusion model for failure of interconnects in microelectronic devices

resolves10.1146/annurev.matsci.38.060407.130253

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

resolves10.1109/5.705525

Defect tolerance in VLSI circuits: techniques and yield analysis

resolves10.1109/TCAD.2010.2061570

DABISR: A Defect-Aware Built-In Self-Repair Scheme for Single/Multi-Port RAMs in SoCs

resolves10.1109/TDSC.2008.37

Is Asynchronous Logic More Robust Than Synchronous Logic?

resolves10.1016/0022-5088(69)90121-0

On the resistivity and surface tension of the eutectic alloy of gallium and indium

resolves10.1002/anie.200703642

Eutectic Gallium–Indium (EGaIn): A Moldable Liquid Metal for Electrical Characterization of Self‐Assembled Monolayers

resolves10.3109/02652040309178083

<i>In situ</i>poly(urea-formaldehyde) microencapsulation of dicyclopentadiene

resolves10.1002/adfm.200701216

Eutectic Gallium‐Indium (EGaIn): A Liquid Metal Alloy for the Formation of Stable Structures in Microchannels at Room Temperature

resolves10.1016/j.compscitech.2007.07.021

Nanocapsules for self-healing materials

resolves10.1038/35057232

Autonomic healing of polymer composites

The 1 reference without a DOI — listed, not checked

no DOI — not checkede_1_2_5_7_2

What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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