Reference health
High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device
37/37 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
2 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 37 checked references that resolve
resolves10.1016/0038-1101(96)00045-7
Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review
resolves10.1016/j.microrel.2011.07.088
Low-temperature low-pressure die attach with hybrid silver particle paste
resolves10.1109/JPROC.2002.1021571
High-temperature electronics - a role for wide bandgap semiconductors?
resolves10.1016/j.corsci.2014.12.014
The role of Zn precipitates and Cl− anions in pitting corrosion of Sn–Zn solder alloys
resolves10.1016/j.actamat.2005.01.047
Metal–metal bonding process using Ag metallo-organic nanoparticles
resolves10.1007/s11664-013-2967-3
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
resolves10.1016/j.jallcom.2014.08.062
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
resolves10.1016/j.scriptamat.2012.01.007
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
resolves10.1007/s11664-010-1236-y
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders
resolves10.1016/j.scriptamat.2012.02.037
Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications
resolves10.1109/TCAPT.2009.2021256
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
resolves10.1007/s11664-014-3202-6
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
resolves10.1016/j.scriptamat.2013.08.031
Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
resolves10.1016/j.matlet.2015.08.071
Microscale Ag particle paste for sintered joints in high-power devices
resolves10.1016/j.msea.2015.08.032
Effects of hot ring rolling and aging treatment on microstructure and mechanical properties of AZ80-Ag alloy
resolves10.1016/j.msea.2017.02.036
Microstructure, texture and mechanical properties of Mg-Gd-Y-Zr alloy annular forging processed by hot ring rolling
resolves10.1007/s10853-015-9659-8
Die-attaching silver paste based on a novel solvent for high-power semiconductor devices
resolves10.1016/j.jallcom.2016.11.225
In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste
resolves10.1016/j.msea.2016.05.108
Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution
resolves10.1016/j.actamat.2017.02.065
Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
resolves10.1007/s11664-015-3791-8
Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die Attachment
resolves10.4071/2016-HITEC-134
Silver Sintering Paste Rendering Low Porosity Joint for High Power Die Attach Application
resolves10.1016/j.jallcom.2016.08.060
Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering
resolves10.1007/s10853-016-0626-9
Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging
resolves10.1007/s00339-016-0424-x
A comparative study of silver nanoparticles synthesized by arc discharge and femtosecond laser ablation in aqueous solution
resolves10.1088/0370-1301/64/9/303
The Deformation and Ageing of Mild Steel: III Discussion of Results
resolves10.1080/14786440808520496
XCII. Relations between the elastic moduli and the plastic properties of polycrystalline pure metals
resolves10.1016/j.ijthermalsci.2016.05.014
Measurement and modeling of the effective thermal conductivity of sintered silver pastes
The 2 references without a DOI — listed, not checked
no DOI — not checkedG.Q. Lu, J.N. Calata, T.G. Lei, (2008) 2008 5th International Conference on Integrated Power Systems, CIPS 2008
no DOI — not checkedJ. Jiu, H. Zhang, S. Koga, S. Nagao, Y. Izumi, K. Suganuma, J. Mater. Sci. 26, 7183 (2015)
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
Embed this badge
Both snippets point at the live badge image and link back to this page. The badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.
<a href="https://citestamp.com/citestamped/10.1007/s10854-018-8903-9"><img src="https://citestamp.com/citestamped/10.1007/s10854-018-8903-9/badge.svg" alt="CiteStamped reference-health badge" width="460" height="64"></a>
[](https://citestamp.com/citestamped/10.1007/s10854-018-8903-9)