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Microstructural Evolution in the Transient-Liquid-Phase Bonding Area of IN-738LC/BNi-3/IN-738LC

https://doi.org/10.1007/s11661-008-9588-0
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Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

11 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 27 checked references that resolve
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The 11 references without a DOI — listed, not checked
no DOI — not checkedD.F. Paulonis, D.S. Duvall, and W.A. Owczarski: U.S. Patent 3,678,570, 1972
no DOI — not checkedW.D. MacDonald, T.W. Eagar: Metal Science of Joining Conf., TMS, Warrendale, PA, 1992, pp. 93–100
no DOI — not checkedC.G. Bieber, Suffern, and J.J. Galka: U.S. Patent 3,459,545, 1969
no DOI — not checkedIN-738: Technical Data, The International Nickel Company Inc., New York, NY, 1981, pp. 1–11
no DOI — not checkedM.H. Haafkens, G.H. Matthey: Weld. J., 1982, vol. 61 (11), pp. 25–30
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no DOI — not checkedO. Kubaschewski, C.B. Alcock, P.J. Spencer: Materials Thermochemistry, 6th ed., Pergamon, Oxford, United Kingdom, 1993
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