Reference health
Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries
1 of 20 checkable references need attention · checked 2026-07-23
At the dated check, the references listed below either did not resolve in Crossref or DataCite, or carried a retraction notice. Each one is shown with the registry record that put it there.
7 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
References needing attention
does not resolve to a known work10.1179/095066095790151160
The 19 checked references that resolve
resolves10.1016/S1270-9638(99)00108-X
Evolution of Ni-based superalloys for single crystal gas turbine blade applications
resolves10.2514/1.18239
Nickel-Based Superalloys for Advanced Turbine Engines: Chemistry, Microstructure and Properties
resolves10.1007/BF02595453
Transient liquid-phase bonding in the NiAl/Cu/Ni system-A microstructural investigation
resolves10.1007/s11661-999-0313-4
Wide-gap transient liquid-phase bonding of Ti-48 at. pct Al - 2 at. pct Cr - 2 at. pct Nb
resolves10.1007/s11837-999-0210-8
Applying TLP bonding to the joining of structural intermetallic compounds
resolves10.1179/026708399101505950
Short Communication Wide gap transient liquid phase bonding of NiAl–Hf to a nickel base superalloy
resolves10.1007/BF02649282
A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
resolves10.1179/174329304X8702
Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy
resolves10.1007/BF02586111
Microstructural study of transient liquid phase bonded cast INCONEL 738LC superalloy
resolves10.1016/j.msea.2005.01.055
Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy
resolves10.1007/s11661-008-9726-8
On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding
resolves10.1179/174328408X281958
On deviation from parabolic behaviour during transient liquid phase bonding
resolves10.1016/j.jallcom.2007.03.019
Creep fracture mechanism of TLP joint of a Ni-base single crystal superalloy
resolves10.1007/s11661-008-9702-3
Braze Alloy Development for Fast Epitaxial High-Temperature Brazing of Single-Crystalline Nickel-Based Superalloys
resolves10.1016/S1359-6454(00)00307-4
Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology
resolves10.1007/BF02667375
Effect of grain boundaries on isothermal solidification during transient liquid phase brazing
The 7 references without a DOI — listed, not checked
no DOI — not checkedN. D. Souza, M. G. Ardakani, M. McLean, and B. A. Shollock: Metall. Mater. Trans. A, 2000, vol. 31A, pp. 2877-86.
no DOI — not checkedM.A. Burke, P.D. Freyer, M.A. Hebbar, G.W. S Wartzbeck, and T.W. Zagar: U.S. Patent 6,331,217 B1, 2001.
no DOI — not checkedX. J. Yuan, M. B. Kim, and C. Y. Kang: Metall. Mater. Trans. A, 2010, vol. 42A, pp. 1310-24.
no DOI — not checkedY. Y. Chu, P. Ji, and J. Ke: Acta Metall. Sinica, 1992, vol. 5B, pp. 87.
no DOI — not checkedY. Nakao, K. Nishimoto, and K. Shinozaki: Trans. Jpn. Welding Soc., 1999, vol. 20, pp. 60-5.
no DOI — not checkedS. Omori, K. Koyama, Y. Hashimoto, and K. Yamada: Nippon Kinzoku Gakkaishi, 1985, vol. 49, pp. 935-9.
no DOI — not checkedW. Kurz and D.J. Fisher: Fundamentals of Solidification, Trans. Tech. Publications, Aedermannsdorf, Switzerland, 1984, pp. 68-72.
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