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Nodule Formation on Copper Electrodeposits in the Rotating Cylinder Hull Cell
34/34 checkable references clean · checked 2026-08-10
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
12 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 34 checked references that resolve
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Electrodeposition of metals and alloys—new results and perspectives
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High Speed Electrodeposition of Copper from Conventional Sulphate Electrolytes
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Editors' Choice—Modeling and Validation of Local Electrowinning Electrode Current Density Using Two Phase Flow and Nernst–Planck Equations
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Experimental Validation of a Computational Fluid Dynamics Model of Copper Electrowinning
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Flow and mass transfer modelling for copper electrowinning: development of instabilities along electrodes
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Hydrodynamic studies in natural and forced convection electrowinning cells
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Galvanostatic and microscopic studies of nodulation during copper electrolysis
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Evaluation of mass transport in copper and zinc electrodeposition using tracer methods
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Validation of a vertical channel flow cell for scalable electrowinning studies
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Rotating cylinder electrode study of the effect of activated polyacrylamide on surface roughness of electrodeposited copper
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Design Considerations for a cylindrical hull cell with forced convection
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CFD Approach to Wagner Number Estimation for a Current Distribution Uniformity in a Rotating Cylinder Hull Cell
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Comparison between Numerical Simulations and Experimental Results on Copper Deposition in Rotating Cylinder Hull Cell
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Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder Hull cell
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Experimental investigation of the primary and secondary current distribution in a rotating cylinder Hull cell
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Toward a Reliable Value for the Diffusion Coefficient of Cupric Ion in Aqueous Solution
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Physico-chemical properties of copper electrorefining and electrowinning electrolytes
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Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system
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Temperature dependence of the cathodic and anodic kinetics in a copper electrowinning cell based on reactive electrodialysis
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Effective Copper Diffusion Coefficients in CuSO4–H2SO4 Electrowinning Electrolytes
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Contribution to the study of copper electrocrystallization in view of industrial applications — submicroscopic and macroscopic considerations
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The effect of copper, acid, and temperature on the diffusion coefficient of cupric ions in simulated electrorefining electrolytes
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Role of Overpotential on Texture, Morphology and Ductility of Electrodeposited Copper Foils for Printed Circuit Board Applications
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Structural Accelerating Effect of Chloride on Copper Electrodeposition
The 12 references without a DOI — listed, not checked
no DOI — not checkedR.C. Dunne, S.K. Kawatra, and C.A. Young: SME Mineral Processing and Extractive Metallurgy Handbook, Society for Mining, Metallurgy & Exploration, 2019, pp. 1369–99.
no DOI — not checkedA.J. Bard and L.R. Faulkner: Electrochemical Methods: Fundamentals and Applications, 1st ed., Wiley, 1980, pp. 289–90.
no DOI — not checkedJ. Aromaa: Aqueous Processing of Metals, Wiley, Weinheim, 2007, pp. 161–223.
no DOI — not checkedJ. Dutrizac and T. Chen: in Proc. COPPER 99 Int. Conf., 1999, pp. 383–403.
no DOI — not checkedM.Z. Mubarok, I. Filzwieser, and P. Paschen: Erzmetall., 2005, vol. 58, p. 315.
no DOI — not checkedA. Lafront, B. Veilleux, and E. Ghali: in Electrometallurgy 2001, Metallurgical Society of CIM, 2001, pp. 389–400.
no DOI — not checkedA. Shukla: Modeling and measuring electrodeposition parameters near electrode surfaces to facilitate cell performance optimization, Department of Metallurgical Engineering, University of Utah, Salt Lake City, 2013.
no DOI — not checkedT. Robinson, K. Sole, S. Sandoval, M. Moats, A. Siegmund, and W. Davenport: in Copper 2013, 2013, pp. 3–14.
no DOI — not checkedE. Ilgar and T. O'Keefe: in Aqueous Electrotechnologies: Progress in Theory and Practice, TMS, Orlando, Florida, Year, pp. 51–62.
no DOI — not checkedC. Madore, D. Landolt, C. Hassenpflug, and J. Hermann: Plat. Surf. Finish., 1995, vol. 82, pp. 36–41.
no DOI — not checkedY. Khouraibchia: Improving the Fundamental Understanding of Copper Electrowinning, Department of Metallurgical Engineering , University of Utah, Salt Lake City, 2009.
no DOI — not checkedK. Popov, S.S. Djokić, and B. Grgur: Fundamental Aspects of Electrometallurgy, Springer, Berlin, 2007, pp. 57–9.
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