Reference health
Experiment and Simulation for Rolling of Diamond–Cu Composites
27/27 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
17 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 27 checked references that resolve
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On the role of processing parameters in producing Cu/SiC metal matrix composites via friction stir processing: Investigating microstructure, microhardness, wear and tensile behavior
resolves10.1016/j.matdes.2014.05.068
Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites
resolves10.1016/j.ceramint.2015.08.173
Preparation and thermophysical properties of directional SiC/Cu–Si composite via spontaneous infiltration
resolves10.1016/j.compositesb.2012.11.014
Fabrication of diamond/aluminum composites by vacuum hot pressing: Process optimization and thermal properties
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High thermal conductive diamond/Cu–Ti composites fabricated by pressureless sintering technique
resolves10.1007/s10854-014-2381-5
Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles
resolves10.1016/S0167-577X(01)00330-5
Thermal conductivity of W–Cu composites at various temperatures
resolves10.1023/A:1026749831726
Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications
resolves10.1016/j.msea.2006.12.146
Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications
resolves10.1007/s12613-011-0465-2
Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration
resolves10.1016/j.scriptamat.2007.08.007
On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites
resolves10.1016/j.fusengdes.2010.08.043
Thermal conductivity and thermal expansion coefficient of diamond/5wt%Si–Cu composite by vacuum hot pressing
resolves10.1007/s10853-010-4938-x
High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix
resolves10.1016/S0167-577X(03)00433-6
A study on graphitization of diamond in copper–diamond composite materials
resolves10.1016/S0924-0136(96)02649-0
Deformation analysis of composites formed by powder plating and rolling
resolves10.1016/S0924-0136(96)02658-1
The characteristics of the deformation and flow process in the rolling of metal sheets and metal powders of composite materials
resolves10.1007/s12541-015-0200-4
Finite element simulation and experiment verification of rolling forming for the truck wheel rim
resolves10.1177/002199838702100602
Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance
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Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance
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Micro-thermoelectric cooler: interfacial effects on thermal and electrical transport
resolves10.1016/j.scriptamat.2011.09.028
Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles
resolves10.1016/j.compscitech.2011.06.012
Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
resolves10.1016/0013-7944(85)90052-9
Fracture characteristics of three metals subjected to various strains, strain rates, temperatures and pressures
resolves10.1016/j.ijimpeng.2007.12.006
Material characterisation and constitutive modelling of a tungsten-sintered alloy for a wide range of strain rates
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no DOI — not checkedK.K. Wang, S.X. Wang, K.Y. Duan, J.L. Fu, Q. Gao, Chinese Patent, No. 201410270309, 2 Aug 2014
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