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Texture transformations in Ag thin films

https://doi.org/10.1016/j.actamat.2013.07.061
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32/32 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

7 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 32 checked references that resolve
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Formation of Copper Thin Films by a Low Kinetic Energy Particle Process
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Competition between strain and interface energy during epitaxial grain growth in Ag films on Ni(001)
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Effects of barrier layer and annealing on abnormal grain growth in copper thin films
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Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substrates
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The effect of thermal grooving on grain boundary motion
The 7 references without a DOI — listed, not checked
no DOI — not checked10.1016/j.actamat.2013.07.061_b0040
no DOI — not checkedBaker SP, Saha K, Shu JB. 2013 [submitted for publication].
no DOI — not checked10.1016/j.actamat.2013.07.061_b0125
no DOI — not checked10.1016/j.actamat.2013.07.061_b0130
no DOI — not checked10.1016/j.actamat.2013.07.061_b0140
no DOI — not checked10.1016/j.actamat.2013.07.061_b0160
no DOI — not checkedNucleation in recrystallization
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