Reference health
Enhanced thermal conductivity of metallic nanoparticle packed bed by sintering treatment
21/21 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 21 checked references that resolve
resolves10.1007/s11663-010-9365-5
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
resolves10.1109/JPROC.2002.1021571
High-temperature electronics - a role for wide bandgap semiconductors?
resolves10.1016/j.solidstatesciences.2010.12.025
Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties
resolves10.1021/la802182y
Ink-Jet Printing of Cu−Ag-Based Highly Conductive Tracks on a Transparent Substrate
resolves10.1063/1.3511688
The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors
resolves10.1109/TADVP.2004.831843
Materials and Processes for Implementing High-Temperature Liquid Interconnects
resolves10.1007/s11664-008-0550-0
Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders
resolves10.1016/j.actamat.2005.01.047
Metal–metal bonding process using Ag metallo-organic nanoparticles
resolves10.1039/c2jm34954j
A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
resolves10.1039/c1jm12108a
Preparation of PVP coated Cu NPs and the application for low-temperature bonding
resolves10.1186/s11671-017-1969-0
Experimental Study on Thermal Conductivity and Hardness of Cu and Ni Nanoparticle Packed Bed for Thermoelectric Application
resolves10.1016/S0032-5910(03)00094-9
The effect of wall friction in the compaction of pharmaceutical tablets with curved faces: a validation study of the Drucker–Prager Cap model
resolves10.1016/S0955-2219(02)00010-9
Effect of nano-micro TiN addition on the microstructure and mechanical properties of TiC based cermets
resolves10.1016/j.powtec.2010.12.001
Mixing of carbon nanotubes (CNTs) and aluminum powder for powder metallurgy use
resolves10.1016/j.ijrmhm.2016.04.016
Mechanical properties and rapid consolidation of nanostructured WC and WC–Al 2 O 3 composites by high-frequency induction-heated sintering
resolves10.1016/j.jallcom.2004.06.015
Fabrication of B4C particulate reinforced magnesium matrix composite by powder metallurgy
resolves10.1140/epjp/i2015-15239-5
Thermal conductivity of silica nanoparticle powder: Measurement and theoretical analysis
The 3 references without a DOI — listed, not checked
no DOI — not checked10.1016/j.applthermaleng.2017.03.087_b0055
no DOI — not checked10.1016/j.applthermaleng.2017.03.087_b0110
no DOI — not checked10.1016/j.applthermaleng.2017.03.087_b0115
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