Reference health
Mechanical properties and thermal conductivity of Si3N4 ceramics with YF3 and MgO as sintering additives
21/21 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 21 checked references that resolve
resolves10.1016/S0272-8842(01)00008-6
Effect of Y2O3 and Yb2O3 on the microstructure and mechanical properties of silicon nitride
resolves10.1111/j.1551-2916.2010.04196.x
Effect of Heating Rate on Spark Plasma Sintering of a Nanosized β‐Si
<sub>3</sub>
N
<sub>4</sub>
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resolves10.1016/j.msea.2015.07.062
Fabrication and properties of graphene reinforced silicon nitride composite materials
resolves10.1002/9780470314715.ch52
Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing
resolves10.1111/j.1151-2916.1999.tb02209.x
Thermal Conductivity of ß‐Si3N4: I, Effects of Various Microstructural Factors
resolves10.1111/j.1151-2916.2000.tb01501.x
Thermal Conductivity of β‐Si
<sub>3</sub>
N
<sub>4</sub>
: II, Effect of Lattice Oxygen
resolves10.1111/j.1151-2916.2001.tb00662.x
Thermal Conductivity of β‐Si
<sub>3</sub>
N
<sub>4</sub>
: III, Effect of Rare‐Earth (RE = La, Nd, Gd, Y, Yb, and Sc) Oxide Additives
resolves10.1111/j.1551-2916.2006.01195.x
Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics
resolves10.1111/j.1551-2916.2006.01462.x
Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride: (II) Effects of Magnesium Compound and Yttria Additives
resolves10.1016/j.jeurceramsoc.2014.01.025
A strategy for fabricating textured silicon nitride with enhanced thermal conductivity
resolves10.1111/j.1151-2916.2004.tb07747.x
Effect of Sintering Additive Composition on the Processing and Thermal Conductivity of Sintered Reaction‐Bonded Si
<sub>3</sub>
N
<sub>4</sub>
resolves10.1111/j.1744-7402.2012.02767.x
Effects of Impurity Iron Content on Characteristics of Sintered Reaction‐Bonded Silicon Nitride
resolves10.1111/ijac.12035
Effect of Aluminum Content on Mechanical Properties and Thermal Conductivities of Sintered Reaction‐Bonded Silicon Nitride
resolves10.1016/j.jascer.2015.03.003
Development of high-thermal-conductivity silicon nitride ceramics
resolves10.1111/j.1151-2916.2001.tb01141.x
MgSiN
<sub>2</sub>
Addition as a Means of Increasing the Thermal Conductivity of β‐Silicon Nitride
resolves10.2109/jcersj2.116.706
Effect of MgSiN2 addition on gas pressure sintering and thermal conductivity of silicon nitride with Y2O3
resolves10.1007/BF00724706
Evaluation ofK Ic of brittle solids by the indentation method with low crack-to-indent ratios
resolves10.1016/j.msea.2014.11.021
Characterization of fracture and deformation mechanism in a high strength beta titanium alloy Ti-10-2-3 using EBSD technique
resolves10.1016/j.jeurceramsoc.2016.01.018
Effect of sintering techniques on the microstructure of liquid-phase-sintered SiC ceramics
The 3 references without a DOI — listed, not checked
no DOI — not checkedPotential use of only Yb2O3 in producing dense Si3N4 ceramics with high thermal conductivity by gas pressure sintering
no DOI — not checkedSaturated domain switching textures and strains in ferroelastic ceramics
no DOI — not checked10.1016/j.ceramint.2016.07.024_bib24
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