Reference health
Enhanced thermal conductivity of polymer composites filled with hybrid filler
12/12 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
8 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 12 checked references that resolve
resolves10.1016/S0040-6031(98)00463-8
Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine
resolves10.1109/ITHERM.1988.28676
Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation
resolves10.1109/STHERM.1989.76077
Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)
resolves10.1007/s10853-005-6947-8
Comparisons of thermal properties between inorganic filler and acid-treated multiwall nanotube/polymer composites
resolves10.1007/BF02135027
A computer-controlled apparatus for thermal conductivity measurement by the transient hot wire method
resolves10.1068/htwu289
Transient thermal conductivity measurements: comparison of destructive and nondestructive techniques
resolves10.1016/S1359-835X(01)00023-9
Thermally conducting aluminum nitride polymer-matrix composites
The 8 references without a DOI — listed, not checked
no DOI — not checkedProcter P, Solc J. Improved thermal conductivity in microelectronic encapsulants. Dexter's technical paper 1999;February:1–8.
no DOI — not checked10.1016/j.compositesa.2005.07.006_bib2
no DOI — not checked10.1016/j.compositesa.2005.07.006_bib8
no DOI — not checked10.1016/j.compositesa.2005.07.006_bib9
no DOI — not checked10.1016/j.compositesa.2005.07.006_bib11
no DOI — not checkedThe probe method for measurement of thermal conductivity
no DOI — not checkedMathis N. Eliminating density and heat capacity requirement in transient thermal conductivity measurements. In: ANTEC 1999 proceedings, New York, May 3–6; 1999.
no DOI — not checkedPark, M, et al. KIST report on the development of high performance package materials, 2002. Oxmat's MacroPac Manual; 2001.
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