Every reference with a DOI in the deposited reference list resolved to a known
work in Crossref or DataCite at the dated check, and none carried a retraction,
withdrawal, or removal notice.
The 39 checked references that resolve
resolves10.1007/s10854-017-6541-2Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling
resolves10.1111/jace.16015Effects of yttria and magnesia on densification and thermal conductivity of sintered reaction‐bonded silicon nitrides
resolves10.1007/BF01161167Relationships between processing, microstructure and properties of dense and reaction-bonded silicon nitride
resolves10.1038/417266aFormation of tough interlocking microstructures in silicon nitride ceramics by dynamic ripening
resolves10.1111/jace.15240Stress distribution around Fe
<sub>5</sub>
Si
<sub>3</sub>
and its effect on interface status and mechanical properties of Si
<sub>3</sub>
N
<sub>4</sub>
ceramics
resolves10.1111/jace.15544Enhanced thermal conductivity in Si
<sub>3</sub>
N
<sub>4</sub>
ceramic with the addition of Y
<sub>2</sub>
Si
<sub>4</sub>
N
<sub>6</sub>
C
resolves10.4028/www.scientific.net/KEM.434-435.783Fabrication of High Thermal Conductivity β-Si<sub>3</sub>N<sub>4</sub> Ceramics at Relatively Low Temperature Using MgSiN<sub>2</sub> as Additives
resolves10.2109/jcersj2.116.706Effect of MgSiN2 addition on gas pressure sintering and thermal conductivity of silicon nitride with Y2O3
resolves10.1016/j.ceramint.2018.06.237Comparative study of fluoride and non-fluoride additives in high thermal conductive silicon nitride ceramics fabricated by spark plasma sintering and post-sintering heat treatment
resolves10.2109/jcersj2.16055Microstructural evolution of Si<sub>3</sub>N<sub>4</sub> ceramics from starting powders with different &alpha;-to-&beta; ratios
resolves10.1016/j.actamat.2007.06.014Processing and properties of sintered reaction-bonded silicon nitride with Y2O3–MgSiN2: Effects of Si powder and Li2O addition
resolves10.1111/jace.16902ZrSi
<sub>2</sub>
–MgO as novel additives for high thermal conductivity of β‐Si
<sub>3</sub>
N
<sub>4</sub>
ceramics
resolves10.1002/adem.201000012Hot‐Pressed ZrB<sub>2</sub> Ceramics With Composite Additives of Zr and B<sub>4</sub>C
resolves10.1016/j.ceramint.2020.06.283Effect of Zr and C co-addition on the characteristics of ZrB2-based ceramics: Role of spark plasma sintering temperature
resolves10.1111/j.1744-7402.2011.02618.xEffects of Impurity Oxygen Content in Raw Si Powder on Thermal and Mechanical Properties of Sintered Reaction‐Bonded Silicon Nitrides
resolves10.1111/ijac.13220High thermal conductivity silicon nitride ceramics prepared by pressureless sintering with ternary sintering additives
resolves10.1557/JMR.1995.0240Phase relationships in the system Si<sub>3</sub>N<sub>4</sub>–SiO<sub>2</sub>–Yb<sub>2</sub>O<sub>3</sub>
The 6 references without a DOI — listed, not checked
no DOI — not checkedPresent status and future prospect of widegap semiconductor high-power devices
no DOI — not checkedHigh heat dissipation and high heat durability technologies for transfer-molded power modules with insulating sheets
no DOI — not checkedMicrostructural evolution of TiB2–SiC composites empowered with Si3N4, BN or TiN: a comparative study
no DOI — not checkedOpportunities for enhancing the thermal conductivities of SiC and Si3N4 ceramics through improved processing
no DOI — not checkedA novel ZrB2-based composite manufactured with Ti3AlC2 additive
no DOI — not checkedThermal decomposition behavior of ZrH2 particles and its effect on distributions of elements in aluminum foam
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