Reference health
Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics
19/19 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
6 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 19 checked references that resolve
resolves10.1016/j.scriptamat.2017.11.035
Bonding technology based on solid porous Ag for large area chips
resolves10.1007/s11664-005-0178-2
Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications
resolves10.1039/b821327e
Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing
resolves10.1016/j.msea.2006.02.401
Magnetic pulsed compaction of ferromagnetic nano-powders for soft-magnetic core
resolves10.1016/j.actamat.2010.02.018
Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process
resolves10.1016/j.actamat.2010.10.053
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
resolves10.1007/s11664-014-3257-4
Low Temperature Consolidation of Micro/Nanosilver Die-Attach Preforms
resolves10.1021/am800177d
Poly(ethylene imine) and Tetraethylenepentamine as Protecting Agents for Metallic Copper Nanoparticles
resolves10.1039/C6RA16474A
Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air
resolves10.1007/s10853-017-1689-y
Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics
resolves10.1039/c1jm12108a
Preparation of PVP coated Cu NPs and the application for low-temperature bonding
resolves10.1155/2016/5284048
Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
resolves10.1016/j.jallcom.2017.07.045
A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics
The 6 references without a DOI — listed, not checked
no DOI — not checkedSynthesis and characterization of copper nanoparticles (Cu-Nps) using Rongalite as reducing agent and photonic sintering of Cu-Nps ink for printed electronics
no DOI — not checkedSynthesis of Cu core Ag shell nanoparticles using chemical reduction method
no DOI — not checkedA study of chemical reactions of silver and indium at 180°C
no DOI — not checkedPreparation and sintering properties in air of silver-coated copper powders and pastes
no DOI — not checkedLow temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD
no DOI — not checkedDynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
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