Reference health
Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes
82/82 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
6 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 82 checked references that resolve
resolves10.1016/S0142-1123(01)00144-X
Mixed mode I/II fracture and fatigue crack growth along 63Sn–37Pb solder/brass interface
resolves10.1016/j.mseb.2003.09.003
Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging
resolves10.1016/j.actamat.2003.12.042
Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
resolves10.1016/j.surfcoat.2005.02.193
Advancement in low melting solder deposition by pulsed Magnetron Sputter-PVD process for microsystemtechnology
resolves10.1016/j.jct.2012.06.024
Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system
resolves10.1016/j.msea.2012.05.086
Effect of iron and indium on IMC formation and mechanical properties of lead-free solder
resolves10.1016/j.matdes.2013.04.081
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders
resolves10.1016/j.jallcom.2013.03.034
Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification
resolves10.1016/j.actamat.2012.09.033
Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder
resolves10.1016/j.jallcom.2013.03.234
Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys
resolves10.1016/j.cplett.2010.08.082
Melting and solidification point of fcc-metal nanoparticles with respect to particle size: A molecular dynamics study
resolves10.1016/j.matchemphys.2012.11.016
Size-dependent melting point of nanoparticles based on bond number calculation
resolves10.1016/j.matdes.2011.11.005
Silver nanoparticle-assisted diffusion brazing of 3003 Al alloy for microchannel applications
resolves10.1016/j.materresbull.2012.06.067
Models for mean bonding length, melting point and lattice thermal expansion of nanoparticle materials
resolves10.1016/j.actamat.2005.01.047
Metal–metal bonding process using Ag metallo-organic nanoparticles
resolves10.1109/TCAPT.2005.853167
Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
resolves10.1016/j.microrel.2009.05.004
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages
resolves10.1143/JJAP.48.125004
Low-Temperature Bonding Using Silver Nanoparticles Stabilized by Short-Chain Alkylamines
resolves10.1016/j.microrel.2011.07.088
Low-temperature low-pressure die attach with hybrid silver particle paste
resolves10.1016/j.apsusc.2012.10.186
An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H]
resolves10.1039/c1jm12108a
Preparation of PVP coated Cu NPs and the application for low-temperature bonding
resolves10.2174/1876531901103010060
Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste
resolves10.1016/j.microrel.2014.07.113
Reliability of Cu nanoparticle joint for high temperature power electronics
resolves10.1016/j.scriptamat.2016.04.018
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
resolves10.1016/j.solidstatesciences.2010.12.025
Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties
resolves10.1016/j.ijadhadh.2011.11.002
Metal–metal bonding process using metallic copper nanoparticles prepared in aqueous solution
resolves10.1260/1708-5284.10.2.113
Preparation of copper nanoparticles and metal-metal bonding process using them
resolves10.2298/JMMB120927025K
Synthesis of silver/copper nanoparticles and their metalmetal bonding property
resolves10.1179/1362171812Y.0000000038
Synthesis of metallic copper nanoparticles using copper oxide nanoparticles as precursor and their metal–metal bonding properties
resolves10.1002/sia.5299
Microstructure of metallic copper nanoparticles/metallic disc interface in metal–metal bonding using them
resolves10.1016/j.jmrt.2013.12.003
A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles
resolves10.1007/s11051-011-0522-9
Preparation of CuO nanoparticles by metal salt-base reaction in aqueous solution and their metallic bonding property
resolves10.1252/jcej.14we134
Low-Temperature Metal^|^#8211;Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles
resolves10.2320/matertrans.MRA2008269
Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles
resolves10.1006/jcis.1996.4638
Preparation and Growth Mechanism of Uniform Colloidal Copper Oxide by the Controlled Double-Jet Precipitation
resolves10.1016/j.materresbull.2005.10.013
Large-scale synthesis of single-crystalline CuO nanoplatelets by a hydrothermal process
resolves10.1016/j.matlet.2006.08.063
Solution-phase synthesis of CuO hierarchical nanosheets at near-neutral pH and near-room temperature
resolves10.1016/j.scitotenv.2012.01.012
Dispersion and stability of bare hematite nanoparticles: Effect of dispersion tools, nanoparticle concentration, humic acid and ionic strength
resolves10.1016/j.colsurfa.2015.03.024
Streaming potential method for characterizing the overlapping of diffuse layers of the electrical double layers between oppositely charged particles
resolves10.1016/j.jcis.2015.01.004
From colloidal spheres to nanofibrils: Extensional flow properties of mineral pigment and mixtures with micro and nanofibrils under progressive double layer suppression
resolves10.1016/j.jhazmat.2011.01.027
Catalytic wet peroxide oxidation of azo dye (Direct Blue 15) using solvothermally synthesized copper hydroxide nitrate as catalyst
resolves10.1016/j.solmat.2014.09.010
Electrochemically prepared cuprous oxide film for photo-catalytic oxygen evolution from water oxidation under visible light
resolves10.1016/j.ceramint.2013.04.055
Green sonochemical synthesis of cupric and cuprous oxides nanoparticles and their optical properties
resolves10.1016/j.powtec.2012.11.006
A rapid, one pot microwave assisted synthesis of nanosize cuprous oxide
resolves10.1016/j.jallcom.2010.09.089
Synthesis and characterization of cuprous oxide dendrites: New simplified green hydrothermal route
resolves10.1016/j.tetlet.2013.09.079
Ligand-free catalytic system for the synthesis of diarylethers over Cu2O/Cu-CNTs as heterogeneous reusable catalyst
resolves10.1088/0370-1301/64/9/303
The Deformation and Ageing of Mild Steel: III Discussion of Results
resolves10.1016/j.jcis.2004.01.071
Synthesis of high-concentration Cu nanoparticles in aqueous CTAB solutions
resolves10.1016/S1003-6326(10)60047-7
Preparation of copper nanoparticles by chemical reduction method using potassium borohydride
resolves10.1016/j.colsurfa.2010.01.069
Structural and surface plasmon behavior of Cu nanoparticles using different stabilizers
resolves10.1039/b005769j
Sonochemical synthesis of amorphous Cu and nanocrystalline Cu2O embedded in a polyaniline matrix
resolves10.1016/j.poly.2008.09.027
Synthesis of oleylamine capped copper nanocrystals via thermal reduction of a new precursor
resolves10.1016/S0965-9773(98)00153-6
Radiation induced synthesis and characterization of copper nanoparticles
resolves10.1016/j.cplett.2006.02.072
First hyperpolarizabilities of unprotected and polymer protected copper nanoparticles prepared by laser ablation
resolves10.1016/j.colsurfa.2007.11.009
Silica-coating of metallic copper nanoparticles in aqueous solution
resolves10.1016/j.mseb.2007.07.045
Ln3+:KLu(WO4)2/KLu(WO4)2 epitaxial layers: Crystal growth and physical characterisation
resolves10.1016/j.jcrysgro.2009.01.137
Epitaxial growth of Sm(Co,Cu)5 thin film on Al2O3(0001) single-crystal substrate
resolves10.1016/j.jcrysgro.2008.09.180
Lattice-mismatched InGaP/GaAs (111)B liquid phase epitaxy with epitaxial lateral overgrowth
resolves10.1016/j.jcrysgro.2011.12.092
Epitaxial growth of self-ordered ZnO nanostructures on sapphire substrates by seed-assisted hydrothermal growth
resolves10.1016/j.materresbull.2006.04.008
Effects of various polyoxyethylene sorbitan monooils (Tweens) and sodium dodecyl sulfate on reflux synthesis of copper nanoparticles
resolves10.1103/PhysRevB.75.085434
Size-dependent melting of spherical copper nanoparticles embedded in a silica matrix
resolves10.1016/j.matchemphys.2009.02.008
Size dependent Debye temperature and mean square displacements of nanocrystalline Au, Ag and Al
resolves10.1016/j.mineng.2013.01.009
The effects of X-ray irradiation and temperature on the formation and stability of chemical species on enargite surfaces during XPS
resolves10.1016/S0022-0728(03)00105-0
XPS and ARXPS study of silver underpotential deposition on platinum in acid solution
resolves10.1016/j.tsf.2003.11.242
Study of structure and optical properties of silver oxide films by ellipsometry, XRD and XPS methods
resolves10.1016/j.apsusc.2012.05.095
XPS study of silver, nickel and bimetallic silver–nickel nanoparticles prepared by seed-mediated growth
The 6 references without a DOI — listed, not checked
no DOI — not checkedTin–lead (SnPb) solder reaction in flip chip technology
no DOI — not checkedPreparation of metallic copper nanoparticles by reduction of copper ions in aqueous solution and their metal-metal bonding properties
no DOI — not checkedEffects of reductant concentration and reduction temperature in synthesis of copper nanoparticles on their metal-metal bonding properties
no DOI — not checkedMetal-metal bonding process using copper nanoparticles
no DOI — not checkedMetal-metal bonding process using Ag2O/CuO Mixed Particles
no DOI — not checkedThe cleavage strength of polycrystals
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
Embed this badge
Both snippets point at the live badge image and link back to this page. The badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.
<a href="https://citestamp.com/citestamped/10.1016/j.jsamd.2016.11.002"><img src="https://citestamp.com/citestamped/10.1016/j.jsamd.2016.11.002/badge.svg" alt="CiteStamped reference-health badge" width="460" height="64"></a>
[](https://citestamp.com/citestamped/10.1016/j.jsamd.2016.11.002)