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Effects of Flux Residues on Surface Insulation Resistance and Electrochemical Migration
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no DOI — not checkedHarsányi G. Failures of microcircuits’ innterconnections caused by electrochemical migration, DSc dissertation, Hungarian Academy of Sciences, Budapest; 2000.
no DOI — not checkedVicsek T. Fractal geometry, dinamical scaling and pattern-formation in growth processes, DSc dissertation, Hungarian Academy of Sciences, Budapest; 1988.
no DOI — not checkedEN-60068-2 (IEC 68-2). Environmental test methods.
no DOI — not checkedDominkovics Cs, Harsányi G. Qualitative and quantitative analysis of lead-free solder coated printed circuit board’s reliability especially considering the electrochemical migration. In: Proceedings of 11th international symposium for design and technology of electronic packaging, September 22–25, Cluj-Napoca, Romania; 2005. p. 80–4.
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no DOI — not checkedIPC-TM-650. Section 2.5 electrical test methods and section 2.6 environmental test methods.
no DOI — not checkedIPC-TM-650. Test methods manual, section 2.6 environmental test methods, 2.6.14.1 electrochemical migration resistance test, electrochemical migration test group.
no DOI — not checkedMáté L. Self-affinity and fractal dimensions, manuscript, Budapest; 1994. p. 27–8.
no DOI — not checkedKasprzak W. Measurements, dimensions, invariant models and fractals, SPOLOM, Wroclaw; 2004.
no DOI — not checked<http://www.math.bme.hu/~mate>.
no DOI — not checkedSchuszter M. Analysis of electronmicroscopic images using fractal theory, PhD dissertation, Budapest University of Technology and Economics; 2000.
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no DOI — not checkedMáté L. Fractals, chaos and discrete dinamical systems, part 2: fractal dimensions, manuscript, Budapest; 2000. p. 2.
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