Reference health

Migration issues in sintered-silver die attaches operating at high temperature

https://doi.org/10.1016/j.microrel.2013.07.103
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11/11 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 11 checked references that resolve
resolves10.1016/0038-1101(96)00045-7
Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review
resolves10.1016/j.diamond.2009.09.015
Comparison of high voltage and high temperature performances of wide bandgap semiconductors for vertical power devices
resolves10.1016/j.mseb.2010.10.003
State of the art of high temperature power electronics
resolves10.1109/TCPMT.2010.2100432
Die Attach Materials for High Temperature Applications: A Review
resolves10.1109/EPTC.2010.5702605
Reliability assessment of sintered nano-silver die attachment for power semiconductors
resolves10.4071/HITEC-GLu-TA15
“Migration of Sintered Nanosilver Die-attach Material on Alumina Substrate at High Temperatures”
resolves10.1109/6040.746536
Silver metallization for advanced interconnects
resolves10.1149/1.2100401
A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration
resolves10.1109/33.2957
Metallic electromigration phenomena
resolves10.1109/95.465159
Electrochemical processes resulting in migrated short failures in microcircuits
resolves10.1016/j.microrel.2006.07.080
Initial stage of silver electrochemical migration degradation
The 3 references without a DOI — listed, not checked
no DOI — not checkedGoebl C, Beckedahl P, Braml H. Low temperature sinter technology die attachment for automotive power electronic applications. In: Automotive power electronics, Paris; 2006. p. 5. <www.semikron.com/internet/webcms/objects/pdf/APE2006_Goebl.pdf>.
no DOI — not checkedDiaham S, Locatelli M-L, Valdez-Nava Z. Dielectrics for high temperature SiC device insulation: review of new polymeric and ceramic materials.
no DOI — not checkedKumar R. Parylene ht: a high temperature vapor phase polymer for electronics applications. In: Proceedings of the IMAPS international conference and exhibition on high temperature electronics (HiTEC 2010), IMAPS; May, 2010. p. 108–13.
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record

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