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Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

https://doi.org/10.1016/j.msea.2005.01.055
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15/15 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

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The 15 checked references that resolve
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Effect of gap size and process parameters on diffusion brazing of Inconel 738
resolves10.1361/105497199770340888
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resolves10.1007/s11661-000-0114-2
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Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
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Influence of isothermal solidification on microstructural development in Ni–Si–B filler metals
resolves10.1179/174329304X8702
Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy
resolves10.1007/BF02665011
Microstructural development in transient liquid-phase bonding
resolves10.1179/026708399101505518
Continuous<i>γ′</i>precipitation in directionally solidified IN738 LC alloy
resolves10.1007/s11661-998-0183-1
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The 13 references without a DOI — listed, not checked
no DOI — not checked10.1016/j.msea.2005.01.055_bib2
no DOI — not checked10.1016/j.msea.2005.01.055_bib3
no DOI — not checked10.1016/j.msea.2005.01.055_bib5
no DOI — not checked10.1016/j.msea.2005.01.055_bib6
no DOI — not checked10.1016/j.msea.2005.01.055_bib16
no DOI — not checked10.1016/j.msea.2005.01.055_bib17
no DOI — not checkedR. Sallemark, Progress Report 2, Cost 50 Programme Sweeden, 1975.
no DOI — not checked10.1016/j.msea.2005.01.055_bib20
no DOI — not checked10.1016/j.msea.2005.01.055_bib24
no DOI — not checkedTransient liquid phase bonding processes
no DOI — not checkedTransient liquid phase bonding of NiAl using Ni–Si–B interlayers
no DOI — not checked10.1016/j.msea.2005.01.055_bib27
no DOI — not checked10.1016/j.msea.2005.01.055_bib28
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