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Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

https://doi.org/10.1016/j.scriptamat.2012.01.007

19/19 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

The 19 checked references that resolve

resolves10.1016/0040-6090(86)90422-0

Small particle melting of pure metals

resolves10.1016/j.ssc.2004.03.033

Grain size-dependent diffusion activation energy in nanomaterials

resolves10.1103/PhysRevA.13.2287

Size effect on the melting temperature of gold particles

resolves10.1007/s11664-005-0229-8

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

resolves10.1103/PhysRevB.62.10548

Size-dependent melting point depression of nanostructures: Nanocalorimetric measurements

resolves10.1039/c1jm12108a

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

resolves10.1063/1.3497280

Influence of aggregation on thermal conductivity in stable and unstable nanofluids

resolves10.1088/0957-4484/18/34/345202

All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles

resolves10.1021/nn203336m

Self-Assembly of Large-Scale and Ultrathin Silver Nanoplate Films with Tunable Plasmon Resonance Properties

resolves10.1002/smll.200801551

Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems

resolves10.1016/j.actamat.2005.01.047

Metal–metal bonding process using Ag metallo-organic nanoparticles

resolves10.1007/s00339-008-4807-5

Silver nanosintering: a lead-free alternative to soldering

resolves10.1143/JJAP.47.6615

Study of Bonding Technology Using Silver Nanoparticles

resolves10.1109/TDMR.2006.882196

Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly

resolves10.2320/matertrans.MF200805

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior

resolves10.2174/1876531901103010070

Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application

resolves10.1007/s11664-010-1236-y

Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

resolves10.1109/TCAPT.2009.2021256

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

resolves10.1126/science.1077229

Shape-Controlled Synthesis of Gold and Silver Nanoparticles

What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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