Reference health
Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles
44/44 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 44 checked references that resolve
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Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
resolves10.1016/j.jallcom.2015.02.223
Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment
resolves10.1016/j.matdes.2016.06.099
Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
resolves10.1016/j.scriptamat.2015.08.011
Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device
resolves10.1016/j.scriptamat.2016.04.018
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
resolves10.1021/acsami.6b10280
Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles
resolves10.1016/j.jallcom.2016.11.064
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach
resolves10.1007/s11663-010-9365-5
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
resolves10.1016/j.scriptamat.2016.10.006
Impact of diamond seeding on the microstructural properties and thermal stability of GaN-on-diamond wafers for high-power electronic devices
resolves10.1016/j.actamat.2005.01.047
Metal–metal bonding process using Ag metallo-organic nanoparticles
resolves10.1016/j.microrel.2011.07.088
Low-temperature low-pressure die attach with hybrid silver particle paste
resolves10.1016/j.scriptamat.2012.01.007
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
resolves10.1016/j.matlet.2014.04.127
Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging
resolves10.1016/j.actamat.2015.02.011
Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature
resolves10.1016/j.msea.2015.08.015
Effects of bonding temperature on microstructure, fracture behavior and joint strength of Ag nanoporous bonding for high temperature die attach
resolves10.1016/j.microrel.2016.06.007
Microstructural evolution of sintered silver at elevated temperatures
resolves10.1016/j.jallcom.2016.11.225
In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste
resolves10.1016/j.jallcom.2006.12.142
High-temperature creep and hardness of eutectic 80Au/20Sn solder
resolves10.1016/j.actamat.2004.02.043
Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system
resolves10.1016/j.actamat.2010.10.053
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
resolves10.1149/2.114308jes
Thermally Stable Bonding of SiC Devices with Ceramic Substrates: Transient Liquid Phase Sintering Using Cu/Sn Powders
resolves10.1007/s11664-017-5357-4
A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices
resolves10.1007/s11051-013-1949-y
Synthesis and characterization of air-stable Cu nanoparticles for conductive pattern drawing directly on paper substrates
resolves10.1016/j.colsurfa.2005.10.067
Synthesis of oleate capped Cu nanoparticles by thermal decomposition
resolves10.1016/S0167-577X(03)00252-0
Electroless silver coating on fine copper powder and its effects on oxidation resistance
resolves10.1515/amm-2017-0166
Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses
resolves10.1166/nnl.2017.2464
Die Bonding Using Submicrometer Ag-Coated Cu Particles and Enhancement of Bonding Strength by Resin Infiltration
resolves10.1039/b821327e
Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing
resolves10.1016/j.apsusc.2017.01.006
Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification
resolves10.1016/j.jallcom.2013.02.048
Oxidation behavior of Cu–Ag core–shell particles for solar cell applications
resolves10.1088/1361-6528/aa92ac
Size-dependent melting modes and behaviors of Ag nanoparticles: a molecular dynamics study
resolves10.1016/j.jallcom.2017.07.045
A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics
resolves10.2320/matertrans.47.211
Influence of Bonding Condition on Bonding Process Using Ag Metallo-Organic Nanoparticles for High Temperature Lead-Free Packaging
resolves10.1557/jmr.2014.42
A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line
resolves10.1016/j.jallcom.2016.08.009
Submicron Ag-coated Cu particles and characterization methods to evaluate their quality
The 3 references without a DOI — listed, not checked
no DOI — not checked10.1016/j.scriptamat.2018.02.029_bb0055
no DOI — not checked10.1016/j.scriptamat.2018.02.029_bb0075
no DOI — not checked10.1016/j.scriptamat.2018.02.029_bb0120
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