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Optimized thermal conductivity of diamond/Cu composite prepared with tungsten-copper-coated diamond particles by vacuum sintering technique
32/32 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
2 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 32 checked references that resolve
resolves10.1016/j.vacuum.2015.04.015
Comparison of W–Cu composite coatings fabricated by atmospheric and vacuum plasma spray processes
resolves10.1007/s10853-009-4060-0
Influence of processing route on electrical and thermal conductivity of Al/SiC composites with bimodal particle distribution
resolves10.1016/j.compositesa.2007.08.012
Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications
resolves10.1016/j.vacuum.2010.09.009
Characterization of cemented Cu matrix composites reinforced with SiC
resolves10.1016/j.vacuum.2017.04.026
Influence of Ti content on the microstructure and properties of graphite flake/Cu-Ti composites fabricated by vacuum hot pressing
resolves10.1016/j.compositesb.2014.08.023
Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method
resolves10.1016/j.scriptamat.2015.07.022
High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites
resolves10.1007/s12598-011-0204-x
Interfacial microstructure and properties of diamond/Cu‐
<i>x</i>
Cr composites for electronic packaging applications
resolves10.1016/j.scriptamat.2007.08.007
On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites
resolves10.1016/j.scriptamat.2007.10.011
Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications
resolves10.1002/pssa.201330237
Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature–high pressure method
resolves10.1016/j.compositesa.2016.10.005
Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration
resolves10.1016/j.applthermaleng.2013.11.065
High thermal conductive diamond/Cu–Ti composites fabricated by pressureless sintering technique
resolves10.1016/j.jallcom.2015.06.062
Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration
resolves10.1016/j.jallcom.2009.10.040
Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles
resolves10.1016/j.compscitech.2011.06.012
Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
resolves10.1016/j.surfcoat.2015.07.059
Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing
resolves10.1016/j.matchar.2014.07.025
Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles
resolves10.1016/j.apsusc.2017.01.078
Mo2C coating on diamond: Different effects on thermal conductivity of diamond/Al and diamond/Cu composites
resolves10.1016/j.jallcom.2012.03.045
Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites
resolves10.1007/s10853-013-7409-3
Preparation of high thermal conductivity copper–diamond composites using molybdenum carbide-coated diamond particles
resolves10.1007/s11665-013-0780-z
Improved Thermal Performance of Diamond-Copper Composites with Boron Carbide Coating
resolves10.1016/j.vacuum.2009.09.007
Construction and characterization of a sputter deposition system for coating granular materials
resolves10.1016/j.surfcoat.2012.07.068
Characterisation of sputter deposited niobium and boron interlayer in the copper–diamond system
resolves10.1016/j.diamond.2017.11.010
Theoretical modelling for interface design and thermal conductivity prediction in diamond/Cu composites
resolves10.1007/s12613-012-0565-7
Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique
resolves10.1007/s10853-011-6180-6
Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques
resolves10.1016/j.compositesb.2013.04.017
Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder
resolves10.1007/s00339-013-8117-1
Thermal conductivity enhancement in Cu/diamond composites with surface-roughened diamonds
resolves10.1016/j.microrel.2014.04.006
Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al–matrix composite fabricated by SPS
resolves10.1007/s10853-011-5307-0
Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration
The 2 references without a DOI — listed, not checked
no DOI — not checkedThermal materials solve power electronics challenges
no DOI — not checkedLow-temperature densification of diamond/Cu composite prepared from dual-layer diamond particles
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