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Competition between surface and strain energy during grain growth in free-standing and attached Ag and Cu films on Si substrates

https://doi.org/10.1016/s0169-4332(01)00782-6

23/23 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

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The 23 checked references that resolve

resolves10.1063/1.99542

Room-temperature copper metallization for ultralarge-scale integrated circuits by a low kinetic-energy particle process

resolves10.1116/1.578677

Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films

resolves10.1557/JMR.1999.0162

Thin Film Microstructure Control Using Glancing Angle Deposition by Sputtering

resolves10.1063/1.96543

Surface-energy-driven secondary grain growth in thin Au films

resolves10.1016/0040-6090(72)90103-4

Anomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper films

resolves10.1063/1.348452

Abnormal grain growth in aluminum alloy thin films

resolves10.1063/1.94842

Surface-energy-driven secondary grain growth in ultrathin (&lt;100 nm) films of silicon

resolves10.1063/1.345756

The effects of dopants on surface-energy-driven secondary grain growth in silicon films

resolves10.1063/1.339460

Grain growth and grain size distributions in thin germanium films

resolves10.1063/1.1722742

Theory of Thermal Grooving

resolves10.1016/0001-6160(58)90020-8

The effect of thermal grooving on grain boundary motion

resolves10.1103/PhysRevB.29.6443

Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metals

resolves10.1063/1.336194

Secondary grain growth in thin films of semiconductors: Theoretical aspects

resolves10.1016/S0169-4332(01)00243-4

Dependence of stresses on grain orientations in thin polycrystalline films on substrates: an explanation of the relationship between preferred orientations and stresses

resolves10.1063/1.1698268

A Direct Method of Determining Preferred Orientation of a Flat Reflection Sample Using a Geiger Counter X-Ray Spectrometer

resolves10.1088/0022-3727/3/6/303

Crystal growth and orientations in vacuum-condensed silver films and their systematic dependance on the residual air pressure, film thickness, rate of deposition and substrate temperature

resolves10.1116/1.1312731

Characterization of silver coatings deposited from a hollow cathode source

resolves10.1016/S0040-6090(99)00691-4

Correlation between texture and average grain size in polycrystalline Ag thin films

resolves10.1007/BF00544515

A model for development of orientation of vapour deposits

resolves10.1023/A:1004696531491

Textures and structures of vapor deposits

resolves10.1063/1.344969

Epitaxial grain growth in thin metal films

resolves10.1103/PhysRevLett.50.1285

Semiempirical, Quantum Mechanical Calculation of Hydrogen Embrittlement in Metals

resolves10.1007/BF02666406

Texture and microstructure of thin copper films

The 1 reference without a DOI — listed, not checked

no DOI — not checked10.1016/S0169-4332(01)00782-6_BIB10

What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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