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TEM Observation of Microstructure in Silicon Nitride Ceramics Containing Y<sub>2</sub>O<sub>3</sub>-Nd<sub>2</sub>O<sub>3</sub> Additive
Creep and stress-rupture behavior of Y2O3–Nd2O3-doped silicon nitrides with different additive contents
The 4 references without a DOI — listed, not checked
no DOI — not checkedThe thermal conductivity of ceramic dielectrics
no DOI — not checkedHigh-thermal conductivity of β-Si3N4 prepared by gas pressure sintering
no DOI — not checkedAnnealing effects for structural defects of silicon nitride ceramics
no DOI — not checkedYokota H., Yamada S., and Ibukiyama M. Effect of amount of β-Si3N4 particles on thermal conductivity of β-Si3N4 ceramics. J. Eur. Ceram. Soc. (in press).
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