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Abnormal growth of “giant” grains in silver thin films

https://doi.org/10.1016/s1359-6454(00)00372-4
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24/24 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

5 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 24 checked references that resolve
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Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation
resolves10.1016/0040-6090(81)90404-1
Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
resolves10.1016/0001-6160(58)90020-8
The effect of thermal grooving on grain boundary motion
resolves10.1016/0956-7151(90)90114-V
Simulation of thin film grain structures—I. Grain growth stagnation
resolves10.1016/0956-7151(92)90020-F
Simulation of thin film grain structures—II. Abnormal grain growth
resolves10.1016/0254-0584(95)01512-4
Formation of giant-grain copper interconnects by a low-energy ion bombardment process for high-speed ULSIs
resolves10.1016/0022-5096(96)00022-1
Stress and grain growth in thin films
resolves10.1557/JMR.1994.2411
Competition between strain and interface energy during epitaxial grain growth in Ag films on Ni(001)
resolves10.1016/S1359-6462(99)00205-5
Growth of giant grains in silver thin films
resolves10.1063/1.94842
Surface-energy-driven secondary grain growth in ultrathin (<100 nm) films of silicon
resolves10.1063/1.339460
Grain growth and grain size distributions in thin germanium films
resolves10.1149/1.2069326
Electrical Properties of Giant‐Grain Copper Thin Films Formed by a Low Kinetic Energy Particle Process
resolves10.1557/PROC-391-103
The Influence of Strain Energy Minimization on Abnormal Grain Growth in Copper Thin Films
resolves10.1116/1.588027
Contrast formation in focused ion beam images of polycrystalline aluminum
resolves10.1007/BF01165988
Microtexture determination by electron back-scatter diffraction
resolves10.1016/S0304-3991(96)00104-0
Recent advances in the application of orientation imaging
resolves10.1016/S0304-3991(97)00003-X
Resolution and sensitivity of electron backscattered diffraction in a cold field emission gun SEM
resolves10.4028/www.scientific.net/MSF.273-275.237
Orientationally Resolved Grain Size Distributions in Thin Films
resolves10.1063/1.1722379
Method of Representing Preferred Orientation Data
resolves10.1016/1359-6454(95)00365-7
Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films
resolves10.4028/www.scientific.net/MSF.204-206.83
Grain Growth and Texture Evolution in Thin Films
resolves10.1002/pssb.19690310224
Thermal Expansion of Silicon and Zinc Oxide (I)
resolves10.1016/0001-6160(79)90040-3
Migration of special 〈110〉 tilt boundaries in aluminum bicrystals
resolves10.1016/0040-6090(72)90370-7
Recrystallization of (001) oriented gold films into (111) orientation
The 5 references without a DOI — listed, not checked
no DOI — not checkedMater. Res. Soc. Symp. Proc., 1988–1997, 130, 188, 308, 317, 356 and 436, whole volumes.
no DOI — not checked10.1016/S1359-6454(00)00372-4_BIB16
no DOI — not checked10.1016/S1359-6454(00)00372-4_BIB21
no DOI — not checked10.1016/S1359-6454(00)00372-4_BIB25
no DOI — not checked10.1016/S1359-6454(00)00372-4_BIB27
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