Reference health

Thermomechanical behavior of different texture components in Cu thin films

https://doi.org/10.1016/s1359-6454(01)00127-6
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22/22 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

8 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 22 checked references that resolve
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Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
resolves10.1557/JMR.1991.1498
Measurement and interpretation of stress in copper films as a function of thermal history
resolves10.1557/JMR.1993.1845
Stress development and relaxation in copper films during thermal cycling
resolves10.1016/0040-6090(95)05834-6
Thermal strain and stress in copper thin films
resolves10.1557/JMR.1998.0186
Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation
resolves10.1016/S1359-6454(98)00387-5
Stress–temperature behavior of unpassivated thin copper films
resolves10.1007/BF02666659
Mechanical properties of thin films
resolves10.1557/PROC-356-429
Measurement of the Dependence of Stress and Strain on Crystallographic Orientation in Cu and Al thin Films
resolves10.1115/1.3157642
Comments on Aleck’s Stress Distribution in Clamped Plates
resolves10.1109/33.159891
Thermal stresses in aluminum lines bounded to substrates
resolves10.1146/annurev.ms.20.080190.001333
Grain Growth in Thin Films
resolves10.1016/S1359-6454(99)00178-0
Crack-like grain-boundary diffusion wedges in thin metal films
resolves10.1557/JMR.1998.0405
Textures of thin copper films
resolves10.1007/978-1-4613-9570-6
Residual Stress
resolves10.1515/9783112758175
Röntgenbeugung an Kristallen
resolves10.1063/1.1708903
Temperature Dependence of the Elastic Constants of Cu, Ag, and Au above Room Temperature
resolves10.1557/PROC-505-605
Energy Storage And Recovery In Thin Metal Films On Substrates
resolves10.1007/978-1-4757-1622-1
Thermal Expansion
resolves10.1007/978-1-4757-1631-3
Thermal Expansion
resolves10.1016/S1359-6454(99)00403-6
Activation volume for inelastic deformation in polycrystalline Ag thin films
resolves10.1557/JMR.1993.0237
The yield stress of polycrystalline thin films
resolves10.1557/PROC-436-221
In-Situ Tem Investigation During Thermal Cycling of thin Copper Films
The 8 references without a DOI — listed, not checked
no DOI — not checked10.1016/S1359-6454(01)00127-6_BIB8
no DOI — not checkedKeller, R. -M., Baker, S., Kretschmann, A., Vinci, R. P. and Arzt, E., unpublished research.
no DOI — not checkedWeiss, D. and Arzt, E., submitted for publication.
no DOI — not checkedKretschmann, A., PhD Dissertation, Universität Stuttgart, 1997.
no DOI — not checked10.1016/S1359-6454(01)00127-6_BIB21
no DOI — not checked10.1016/S1359-6454(01)00127-6_BIB22
no DOI — not checkedBaker, S. P. and Keller-Flaig, R. M., unpublished research
no DOI — not checkedKeller, R. -M., PhD Dissertation, Universität Stuttgart, 1996.
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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