Every reference with a DOI in the deposited reference list resolved to a known
work in Crossref or DataCite at the dated check, and none carried a retraction,
withdrawal, or removal notice.
The 30 checked references that resolve
resolves10.1002/adma.201606914LiNbO<sub>3</sub>:Pr<sup>3+</sup>: A Multipiezo Material with Simultaneous Piezoelectricity and Sensitive Piezoluminescence
resolves10.1021/acsami.6b02206Facile Fabrication of MoS<sub>2</sub>-Modified SnO<sub>2</sub> Hybrid Nanocomposite for Ultrasensitive Humidity Sensing
resolves10.1002/aenm.201600355Two‐Dimensional Metal Oxide and Metal Hydroxide Nanosheets: Synthesis, Controlled Assembly and Applications in Energy Conversion and Storage
resolves10.1021/acsami.6b10332Nondestructive Method for Mapping Metal Contact Diffusion in In<sub>2</sub>O<sub>3</sub> Thin-Film Transistors
resolves10.1039/C6NR01085GElectrochemical metallization switching with a platinum group metal in different oxides
resolves10.1016/j.jallcom.2016.07.169Bending stability of flexible amorphous IGZO thin film transistors with transparent IZO/Ag/IZO oxide–metal–oxide electrodes
resolves10.1039/C6TC01098AMassive Ag migration through metal/ceramic nano-multilayers: an interplay between temperature, stress-relaxation and oxygen-enhanced mass transport
resolves10.1016/j.matdes.2014.01.029Evaluation on diffusion bonded joints of TiAl alloy to Ti3SiC2 ceramic with and without Ni interlayer: Interfacial microstructure and mechanical properties
resolves10.1021/acsami.5b02134Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
resolves10.1039/C6RA15897HZero-dimensional to three-dimensional nanojoining: current status and potential applications
resolves10.1038/srep32951Cold welding of gold nanoparticles on mica substrate: Self-adjustment and enhanced diffusion
resolves10.1063/1.118312Time-resolved high-resolution electron microscopy of solid state direct bonding of gold and zinc oxide nanocrystallites at ambient temperature
resolves10.1007/s13404-016-0184-6Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 °C
resolves10.1016/j.tsf.2017.01.045Effect of grain size evolution in an Au-wire ball on debonding failure with the Al-pad in semiconductor devices
checked 2026-07-24 — re-checked daily as this page is visited;
titles and statuses come from Crossref and DataCite and are not part of the signed record
Both snippets point at the live badge image and link back to this page. The
badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.