Reference health
Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions
29/29 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
2 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 29 checked references that resolve
resolves10.1021/am404226e
Room Temperature Synthesis of a Copper Ink for the Intense Pulsed Light Sintering of Conductive Copper Films
resolves10.1039/C4CC08749F
Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics
resolves10.1021/am506765p
A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique
resolves10.1021/nn506034g
High-Performance Flexible Organic Light-Emitting Diodes Using Embedded Silver Network Transparent Electrodes
resolves10.1021/am301654j
Direct Writing Patterns for Electroless Plated Copper Thin Film on Plastic Substrates
resolves10.1039/C4TC02693D
Inkjet printed paper based frequency selective surfaces and skin mounted RFID tags: the interrelation between silver nanoparticle ink, paper substrate and low temperature sintering technique
resolves10.1039/C4TC01422G
Extremely flexible, printable Ag conductive features on PET and paper substrates via continuous millisecond photonic sintering in a large area
resolves10.1039/c2cc30975k
Surfactant-free single-nano-sized colloidal Cu nanoparticles for use as an active catalyst in Ullmann-coupling reaction
resolves10.1166/jnn.2008.237
Size-Controlled Oxidation-Resistant Copper Fine Particles Covered by Biopolymer Nanoskin
resolves10.1016/j.tsf.2011.12.024
Behavior of Cu nanoparticles ink under reductive calcination for fabrication of Cu conductive film
resolves10.1039/C5CP06107E
X-ray diffraction and high-resolution TEM observations of biopolymer nanoskin-covered metallic copper fine particles: preparative conditions and surface oxidation states
resolves10.1088/0957-4484/19/14/145706
The preparation of copper fine particle paste and its application as the inner electrode material of a multilayered ceramic capacitor
resolves10.1007/s11051-015-3277-x
High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate
resolves10.1039/C5NR00956A
Expeditious low-temperature sintering of copper nanoparticles with thin defective carbon shells
resolves10.1246/bcsj.20150305
Effect of Glass Transition Temperature of Stabilizing Polymer of Air-Stable Gelatin-Stabilized Copper Fine Particles during Redox Two-Step Low-Temperature Sintering Process
resolves10.1039/C5RA06599B
Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers
resolves10.1039/C5TC00745C
The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature
resolves10.1039/C5RA21402E
Proton-assisted low-temperature sintering of Cu fine particles stabilized by a proton-initiating degradable polymer
resolves10.1039/c0jm00264j
Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials
resolves10.1039/C5RA25058G
Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu
<sup>2+</sup>
-alkanolamine metallacycle compounds for electrically conductive layer formation
resolves10.1021/acs.langmuir.5b01207
Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink
resolves10.1021/am4036306
A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics
resolves10.1016/j.materresbull.2012.08.052
Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines
resolves10.1016/j.tsf.2011.11.056
Effect of copper concentration in printable copper inks on film fabrication
resolves10.1039/c3tc00572k
Printed electrically conductive composites: conductive filler designs and surface engineering
resolves10.1039/C6TC04360G
Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
The 2 references without a DOI — listed, not checked
no DOI — not checkedSugiyama, T., Kanazaki, M., Arakawa, R. & Kawasaki, H. Low-temperature sintering of metallacyclic stabilized copper nanoparticles and adhesion enhancement of conductive copper film to a polyimide substrate. J. Mater. Sci.: Mater. Electron. 27, 7540–7547 (2016).
no DOI — not checkedAverage of the market prices of copper and silver in January 2017 reported by Financial Timeshttp://markets.ft.com (2017).
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
Embed this badge
Both snippets point at the live badge image and link back to this page. The badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.
<a href="https://citestamp.com/citestamped/10.1038/srep45150"><img src="https://citestamp.com/citestamped/10.1038/srep45150/badge.svg" alt="CiteStamped reference-health badge" width="460" height="64"></a>
[](https://citestamp.com/citestamped/10.1038/srep45150)