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Self-reducible copper ion complex ink for air sinterable conductive electrodes
39/39 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
The 39 checked references that resolve
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Facile Synthesis of Silver Nanoparticles Useful for Fabrication of High-Conductivity Elements for Printed Electronics
resolves10.1002/adfm.200600762
Direct Ink‐Jet Printing of Ag–Cu Nanoparticle and Ag‐Precursor Based Electrodes for OFET Applications
resolves10.1021/cm101937p
Materials and Devices toward Fully Solution Processable Organic Light-Emitting Diodes
resolves10.1021/cm061032+
The Origin of the High Conductivity of Poly(3,4-ethylenedioxythiophene)−Poly(styrenesulfonate) (PEDOT−PSS) Plastic Electrodes
resolves10.1021/nl0608543
Transparent, Conductive, and Flexible Carbon Nanotube Films and Their Application in Organic Light-Emitting Diodes
resolves10.1002/adma.201003188
Emerging Transparent Electrodes Based on Thin Films of Carbon Nanotubes, Graphene, and Metallic Nanostructures
resolves10.1002/adfm.201002290
Highly Conductive PEDOT:PSS Electrode with Optimized Solvent and Thermal Post‐Treatment for ITO‐Free Organic Solar Cells
resolves10.1021/cm9036428
Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligands
resolves10.1021/nn503383z
Vacuum-Free, Maskless Patterning of Ni Electrodes by Laser Reductive Sintering of NiO Nanoparticle Ink and Its Application to Transparent Conductors
resolves10.1039/C1JM12779A
Easy access to Cu
<sup>0</sup>
nanoparticles and porous copper electrodes with high oxidation stability and high conductivity
resolves10.1039/b720032c
Inkjet-printed silver tracks: low temperature curing and thermal stability investigation
resolves10.3390/ma3094626
Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
resolves10.1039/C5TC00215J
Pressure-assisted electrode fabrication using simply synthesized Cu
<sub>3</sub>
Sn alloy nanoparticles
resolves10.1039/b821327e
Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing
resolves10.1021/acs.langmuir.5b01207
Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink
resolves10.1039/c2jm15124c
Highly conductive polymer-decorated Cu electrode films printed on glass substrates with novel precursor-based inks and pastes
resolves10.1021/am2002907
Effect of Carboxylic Acid on Sintering of Inkjet-Printed Copper Nanoparticulate Films
resolves10.1016/j.tsf.2011.04.112
Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes
resolves10.1039/C4TC01820F
Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices
resolves10.1021/acsami.5b12156
Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics
resolves10.1016/j.matchemphys.2014.07.047
Synthesis of copper conductive film by low-temperature thermal decomposition of copper–aminediol complexes under an air atmosphere
resolves10.1021/am4036306
A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics
resolves10.1039/C4CC08749F
Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics
resolves10.1021/jp1104196
Preparation of Elemental Cu and Ni Nanoparticles by the Polyol Method: An Experimental and Theoretical Approach
resolves10.1002/adfm.200700902
Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink‐Jet Printing
resolves10.1038/srep04518
Merging of Kirkendall Growth and Ostwald Ripening: CuO@MnO2 Core-shell Architectures for Asymmetric Supercapacitors
resolves10.1166/jnn.2010.2977
A Low Sintering Temperature and Electrical Performance of Nanoparticle Copper Ink for Use in Ink-Jet Printing
resolves10.1039/c2jm34954j
A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
resolves10.1039/c2jm34569b
Preparation, characterization and reaction mechanism of a novel silver-organic conductive ink
resolves10.1021/am201609w
Inkjet-Printed Gold Electrodes on Paper: Characterization and Functionalization
resolves10.1039/c2jm31381b
Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate
resolves10.1021/jp106994t
Combined Role of Well-Dispersed Aqueous Ag Ink and the Molecular Adhesive Layer in Inkjet Printing the Narrow and Highly Conductive Ag Features on a Glass Substrate
resolves10.1002/chem.201406154
Synthesis of Cu<sub>3</sub>Sn Alloy Nanocrystals through Sequential Reduction Induced by Gradual Increase of the Reaction Temperature
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