Reference health
Highly durable Cu-based electrodes from a printable nanoparticle mixture ink: flash-light-sintered, kinetically-controlled microstructure
27/27 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
1 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 27 checked references that resolve
resolves10.1002/adma.201603486
Progress in 3D Printing of Carbon Materials for Energy‐Related Applications
resolves10.1002/adfm.201202519
Load‐Controlled Roll Transfer of Oxide Transistors for Stretchable Electronics
resolves10.1039/c2jm32977h
Large-scale roll-to-roll photonic sintering of flexo printed silver nanoparticle electrodes
resolves10.1021/acs.chemmater.6b00013
Transversally Extended Laser Plasmonic Welding for Oxidation-Free Copper Fabrication toward High-Fidelity Optoelectronics
resolves10.1039/c1jm11273b
Printed Cu source/drain electrode capped by CuO hole injection layer for organic thin film transistors
resolves10.1039/C4TC01422G
Extremely flexible, printable Ag conductive features on PET and paper substrates via continuous millisecond photonic sintering in a large area
resolves10.1002/adfm.200700902
Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink‐Jet Printing
resolves10.1021/la104136w
Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate
resolves10.1002/smll.201400992
Ag@Ni Core–Shell Nanowire Network for Robust Transparent Electrodes Against Oxidation and Sulfurization
resolves10.1021/nn504308n
Copper Nanowire Networks with Transparent Oxide Shells That Prevent Oxidation without Reducing Transmittance
resolves10.1021/nl301168r
Synthesis of Oxidation-Resistant Cupronickel Nanowires for Transparent Conducting Nanowire Networks
resolves10.1039/b821327e
Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing
resolves10.1039/C5TC00251F
Crystalline structure-tunable, surface oxidation-suppressed Ni nanoparticles: printable magnetic colloidal fluids for flexible electronics
resolves10.1039/C4NR06816E
Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles
resolves10.1039/c3tc00904a
Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors
resolves10.1021/acsami.6b14580
Selective Light-Induced Patterning of Carbon Nanotube/Silver Nanoparticle Composite To Produce Extremely Flexible Conductive Electrodes
resolves10.1021/acs.chemmater.6b01709
Newly Designed Cu/Cu<sub>10</sub>Sn<sub>3</sub> Core/Shell Nanoparticles for Liquid Phase-Photonic Sintered Copper Electrodes: Large-Area, Low-Cost Transparent Flexible Electronics
resolves10.1007/s00339-009-5360-6
Intense pulsed light sintering of copper nanoink for printed electronics
resolves10.1007/s11664-010-1384-0
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics
resolves10.1021/acsnano.5b00053
Copper Nanowire–Graphene Core–Shell Nanostructure for Highly Stable Transparent Conducting Electrodes
resolves10.1039/C5NR01711D
Direct synthesis of graphene 3D-coated Cu nanosilks network for antioxidant transparent conducting electrode
resolves10.1021/nl502647k
Superstable Transparent Conductive Cu@Cu<sub>4</sub>Ni Nanowire Elastomer Composites against Oxidation, Bending, Stretching, and Twisting for Flexible and Stretchable Optoelectronics
resolves10.1021/acsami.7b14654
Ultrathin Plasmonic Optical/Thermal Barrier: Flashlight-Sintered Copper Electrodes Compatible with Polyethylene Terephthalate Plastic Substrates
resolves10.1007/BF00355906
Phase equilibria of the ternary Ag-Cu-Ni system and the interfacial reactions in the Ag-Cu/Ni couples
The 1 reference without a DOI — listed, not checked
no DOI — not checkedM. N. Rahaman , Ceramic Processing , CRC Press, Taylor & Francis Group , 2007
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