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Comparison of texture evolution in Ag and Ag(Al) alloy thin films on amorphous SiO2

https://doi.org/10.1063/1.1682685
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27/27 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

6 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 27 checked references that resolve
resolves10.1063/1.1525070
Thickness dependence on the thermal stability of silver thin films
resolves10.1063/1.1530362
Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-<i>n</i> and SiO2 substrates
resolves10.1016/S0167-9317(01)00580-9
Electromigration resistance of sputtered silver lines using different patterning techniques
resolves10.1063/1.1415051
Investigation of the effects of different annealing ambients on Ag/Al bilayers: Electrical properties and morphology
resolves10.1016/S0040-6090(03)00034-8
Stability of silver thin films on various underlying layers at elevated temperatures
resolves10.1063/1.351333
Modeling of agglomeration in polycrystalline thin films: Application to TiSi2 on a silicon substrate
resolves10.1063/1.366127
Agglomeration of TiSi2 thin film on (100) Si substrates
resolves10.1063/1.1556178
Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide
resolves10.1063/1.105745
Correlation of texture with electromigration behavior in Al metallization
resolves10.1063/1.361168
The role of texture in the electromigration behavior of pure aluminum lines
resolves10.1016/S1359-6454(00)00372-4
Abnormal growth of “giant” grains in silver thin films
resolves10.1016/S0040-6090(99)00691-4
Correlation between texture and average grain size in polycrystalline Ag thin films
resolves10.1016/S0040-6090(00)00972-X
Texture, twinning and secondary extinction of vacuum deposited silver thin films
resolves10.1063/1.366758
Texture and microstructural evolution of thin silver films in Ag/Ti bilayers
resolves10.1063/1.1609646
Improvement of the thermal stability of silver metallization
resolves10.1063/1.357564
Texture in multilayer metallization structures
resolves10.1016/S0040-6090(97)00317-9
Texture in evaporated Ag thin films and its evolution during encapsulation process
resolves10.1016/S0039-6028(98)00363-X
The surface energy of metals
resolves10.1103/PhysRevB.46.7157
Surface energy and work function of elemental metals
resolves10.1016/S0039-6028(02)01547-9
Applicability of the broken-bond rule to the surface energy of the fcc metals
resolves10.1103/PhysRevB.57.7281
Consistent methodology for calculating surface and interface energies
resolves10.1016/S0022-3697(99)00415-1
Surface energy of arbitrary crystal plane of bcc and fcc metals
resolves10.1146/annurev.matsci.30.1.159
Structure Evolution During Processing of Polycrystalline Films
resolves10.1016/S1359-6462(99)00205-5
Growth of giant grains in silver thin films
resolves10.1016/S0924-4247(01)00912-8
Void formation and electromigration in sputtered Ag lines with different encapsulations
resolves10.1103/PhysRevLett.84.5006
Scaling and Universality in Electrical Failure of Thin Films
resolves10.1088/0022-3727/34/9/321
A percolative approach to electromigration in metallic lines
The 6 references without a DOI — listed, not checked
no DOI — not checked2024020718425621600_r25
no DOI — not checked2024020718425621600_r26
no DOI — not checked2024020718425621600_r27
no DOI — not checked2024020718425621600_r28
no DOI — not checked2024020718425621600_r29
no DOI — not checked2024020718425621600_r30
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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