Reference health
Low temperature Cu bonding with large tolerance of surface oxidation
21/21 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 21 checked references that resolve
resolves10.1109/jproc.2002.1021571
High-temperature electronics - a role for wide bandgap semiconductors?
resolves10.1007/s11663-010-9365-5
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
resolves10.1016/j.microrel.2011.07.088
Low-temperature low-pressure die attach with hybrid silver particle paste
resolves10.1109/tpel.2016.2631128
Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications
resolves10.1007/s10854-013-1138-x
Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices
resolves10.1016/j.jsamd.2016.11.002
Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes
resolves10.1007/s11664-013-2583-2
Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
resolves10.1039/c2jm34954j
A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
resolves10.1007/s11664-017-5464-2
Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
resolves10.1016/j.scriptamat.2018.02.029
Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles
resolves10.1149/2.010306jss
A Combined Process of Formic Acid Pretreatment for Low-Temperature Bonding of Copper Electrodes
resolves10.7567/jjap.56.04cc01
Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid
resolves10.1109/tcpmt.2014.2315761
Effect of Formic Acid Vapor <italic>In Situ</italic> Treatment Process on Cu Low-Temperature Bonding
resolves10.1016/j.microrel.2017.12.012
Solderless bonding with nanoporous copper as interlayer for high-temperature applications
resolves10.1108/ssmt-10-2013-0028
Voids investigation in solder joints performed with vapour phase soldering (VPS)
resolves10.1016/S1452-3981(23)06675-0
Electrosynthesis and Characterization of Cu(OH)2 Nanoparticle using Cu and Cu-PVC Electrodes in Alkaline Solution
The 3 references without a DOI — listed, not checked
no DOI — not checked2023080907365658700_c8
no DOI — not checked2023080907365658700_c9
no DOI — not checked2023080907365658700_c11
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