Every reference with a DOI in the deposited reference list resolved to a known
work in Crossref or DataCite at the dated check, and none carried a retraction,
withdrawal, or removal notice.
The 610 checked references that resolve
resolves10.1109/APEC.2011.574464099.3% Efficiency of three-phase inverter for motor drive using GaN-based Gate Injection Transistors
resolves10.1109/ECCE.2012.6342657Evaluation and comparison of silicon and gallium nitride power transistors in LLC resonant converter
resolves10.1002/pssc.200778555High temperature behaviour of GaN HEMT devices on Si(111) and sapphire substrates
resolves10.7567/APEX.11.034102GaN-on-silicon high-electron-mobility transistor technology with ultra-low leakage up to 3000 V using local substrate removal and AlN ultra-wide bandgap
resolves10.1002/pssa.201532572Above 2000 V breakdown voltage at 600 K GaN-on-silicon high electron mobility transistors
resolves10.1063/1.1868870Comparison of the properties of GaN grown on complex Si-based structures
resolves10.3390/ma11101968Strain Analysis of GaN HEMTs on (111) Silicon with Two Transitional AlxGa1−xN Layers
resolves10.1088/0268-1242/29/11/113001Recent progress in metal-organic chemical vapor deposition of $\left( 000\bar{1} \right)$ N-polar group-III nitrides
resolves10.1109/55.43098Power semiconductor device figure of merit for high-frequency applications
resolves10.1063/1.331646Semiconductors for high-voltage, vertical channel field-effect transistors
resolves10.1016/j.jsamd.2017.08.004Static and dynamic characteristics of L g 50 nm InAlN/AlN/GaN HEMT with AlGaN back-barrier for high power millimeter wave applications
resolves10.1063/1.1368156Band parameters for III–V compound semiconductors and their alloys
resolves10.1063/1.371866Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures
resolves10.1116/1.590818Spontaneous and piezoelectric polarization effects in III–V nitride heterostructures
resolves10.1063/1.1654804Acoustic surface wave properties of epitaxially grown aluminum nitride and gallium nitride on sapphire
resolves10.1063/1.369664Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures
resolves10.1063/1.126940Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors
resolves10.1109/55.2067An analytical expression for Fermi level versus sheet carrier concentration for HEMT modeling
resolves10.1109/ISPSD.2014.6855976Characterization and application of 600 V normally-off GaN transistors in hard switching DC/DC converters
resolves10.1088/1674-1056/24/6/067301Formation of two-dimensional electron gas at AlGaN/GaN heterostructure and the derivation of its sheet density expression
resolves10.1063/1.5114866V-shaped dislocations in a GaN epitaxial layer on GaN substrate
resolves10.1063/1.4897338Influence of strain induced by AlN nucleation layer on the electrical properties of AlGaN/GaN heterostructures on Si(111) substrate
resolves10.3390/ma13194271High Breakdown Voltage and Low Buffer Trapping in Superlattice GaN-on-Silicon Heterostructures for High Voltage Applications
resolves10.1016/j.msec.2005.09.002The control of two-dimensional-electron-gas density and mobility in AlGaN/GaN heterostructures with Schottky gate
resolves10.1109/LED.2015.2483760Normally Off AlGaN/GaN MIS-High-Electron Mobility Transistors Fabricated by Using Low Pressure Chemical Vapor Deposition Si<sub>3</sub>N<sub>4</sub> Gate Dielectric and Standard Fluorine Ion Implantation
resolves10.1109/JEDS.2018.2859769Normally-OFF GaN MIS-HEMT With F<sup>−</sup> Doped Gate Insulator Using Standard Ion Implantation
resolves10.1109/TED.2005.862708Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications
resolves10.1002/pssc.200983644Gate‐recessed normally‐off GaN‐on‐ Si HEMT using a new O<sub>2</sub>‐BCl<sub>3</sub> digital etching technique
resolves10.1109/LED.2008.2000607AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications
resolves10.3390/en10020153Technology and Reliability of Normally-Off GaN HEMTs with p-Type Gate
resolves10.1116/1.4967306Effects of interface states and near interface traps on the threshold voltage stability of GaN and SiC transistors employing SiO2 as gate dielectric
resolves10.1186/1556-276X-6-132Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization
resolves10.1109/LED.2005.851122High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment
resolves10.1109/TED.2006.881054Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode
resolves10.3390/nano10112116Charging Effect by Fluorine-Treatment and Recess Gate for Enhancement-Mode on AlGaN/GaN High Electron Mobility Transistors
resolves10.1109/ESSDERC.2013.6818819Influence of fluorine-based dry etching on electrical parameters of AlGaN/GaN-on-Si High Electron Mobility Transistors
resolves10.1002/pssc.200880838Influence of thermal anneal steps on the current collapse of fluorine treated enhancement mode SiN/AlGaN/GaN HEMTs
resolves10.1063/1.4815923Threshold voltage control by gate oxide thickness in fluorinated GaN metal-oxide-semiconductor high-electron-mobility transistors
resolves10.1143/JJAP.46.115Control of Threshold Voltage of Enhancement-Mode Al<sub>x</sub>Ga<sub>1-x</sub>N/GaN Junction Heterostructure Field-Effect Transistors Using p-GaN Gate Contact
resolves10.1109/TED.2007.908601Gate Injection Transistor (GIT)—A Normally-Off AlGaN/GaN Power Transistor Using Conductivity Modulation
resolves10.1109/LED.2015.2465137Forward Bias Gate Breakdown Mechanism in Enhancement-Mode p-GaN Gate AlGaN/GaN High-Electron Mobility Transistors
resolves10.1109/VLSIT.2012.6242496A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors
resolves10.1143/APEX.1.023001Nearly Temperature-Independent Saturation Drain Current in a Multi-Mesa-Channel AlGaN/GaN High Electron Mobility Transistor
resolves10.1143/JJAP.48.081002Drain Current Stability and Controllability of Threshold Voltage and Subthreshold Current in a Multi-Mesa-Channel AlGaN/GaN High Electron Mobility Transistor
resolves10.1186/s11671-017-2189-3Breaking Through the Multi-Mesa-Channel Width Limited of Normally Off GaN HEMTs Through Modulation of the Via-Hole-Length
resolves10.1109/LED.2019.2896359High-Performance Nanowire-Based E-Mode Power GaN MOSHEMTs With Large Work-Function Gate Metal
resolves10.1109/ISPSD.2018.8393646Monolithic integration of GaN-based NMOS digital logic gate circuits with E-mode power GaN MOSHEMTs
resolves10.1109/LED.2007.895391High-Temperature Operation of AlGaN/GaN HEMTs Direct-Coupled FET Logic (DCFL) Integrated Circuits
resolves10.1109/LED.2013.2291854High Temperature Characteristics of GaN-Based Inverter Integrated With Enhancement-Mode (E-Mode) MOSFET and Depletion-Mode (D-Mode) HEMT
resolves10.1063/1.3567927Reduced surface leakage current and trapping effects in AlGaN/GaN high electron mobility transistors on silicon with SiN/Al2O3 passivation
resolves10.1016/j.jcrysgro.2006.10.192C-doped GaN buffer layers with high breakdown voltages for high-power operation AlGaN/GaN HFETs on 4-in Si substrates by MOVPE
resolves10.1143/APEX.4.124101Effects of AlGaN Back Barrier on AlN/GaN-on-Silicon High-Electron-Mobility Transistors
resolves10.3390/mi10100690High Lateral Breakdown Voltage in Thin Channel AlGaN/GaN High Electron Mobility Transistors on AlN/Sapphire Templates
resolves10.1109/JEDS.2018.2872975High Figure-of-Merit (${V}_{\text{BR}}^{\text{2}}$ /${R}_{\text{ON}}$ ) AlGaN/GaN Power HEMT With Periodically C-Doped GaN Buffer and AlGaN Back Barrier
resolves10.1109/TED.2014.2312232Effect of GaN Channel Layer Thickness on DC and RF Performance of GaN HEMTs With Composite AlGaN/GaN Buffer
resolves10.1088/1674-1056/24/2/027101Breakdown mechanisms in AlGaN/GaN high electron mobility transistors with different GaN channel thickness values
resolves10.1109/16.936500Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate
resolves10.1109/LED.2006.881020High Breakdown Voltage Achieved on AlGaN/GaN HEMTs With Integrated Slant Field Plates
resolves10.1109/TED.2006.874090Field-plated 0.25-/spl mu/m gate-length AlGaN/GaN HEMTs with varying field-plate length
resolves10.1063/1.50128662 kV slanted tri-gate GaN-on-Si Schottky barrier diodes with ultra-low leakage current
resolves10.1109/LED.2016.2632044High-Voltage and Low-Leakage AlGaN/GaN Tri-Anode Schottky Diodes With Integrated Tri-Gate Transistors
resolves10.1109/LED.2019.2957700Fast-Switching Tri-Anode Schottky Barrier Diodes for Monolithically Integrated GaN-on-Si Power Circuits
resolves10.1109/TPEL.2020.3008226Ultra-compact, High-Frequency Power Integrated Circuits Based on GaN-on-Si Schottky Barrier Diodes
resolves10.3938/jkps.67.682Characteristics of a field plate connected to T-shaped gate in AlGaN/GaN HEMTs
resolves10.1109/LED.2016.2634528Novel Asymmetric Slant Field Plate Technology for High-Speed Low-Dynamic R<sub>on</sub> E/D-mode GaN HEMTs
resolves10.1109/TED.2006.885679The Effect of an Fe-doped GaN Buffer on off-State Breakdown Characteristics in AlGaN/GaN HEMTs on Si Substrate
resolves10.1109/TED.2014.2364855Buffer Traps in Fe-Doped AlGaN/GaN HEMTs: Investigation of the Physical Properties Based on Pulsed and Transient Measurements
resolves10.1109/LED.2014.2304680Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs
resolves10.1002/pssa.201900687Low On‐Resistance and Low Trapping Effects in 1200 V Superlattice GaN‐on‐Silicon Heterostructures
resolves10.1049/el.2015.1684GaN‐on‐silicon high electron mobility transistors with blocking voltage of 3 kV
resolves10.1109/LED.2019.2915984The Effects of AlN and Copper Back Side Deposition on the Performance of Etched Back GaN/Si HEMTs
resolves10.1143/JJAP.50.100202Low-Resistive Ohmic Contacts for AlGaN Channel High-Electron-Mobility Transistors Using Zr/Al/Mo/Au Metal Stack
resolves10.1063/1.4963860AlGaN channel field effect transistors with graded heterostructure ohmic contacts
resolves10.1063/1.1610244High conductivity modulation doped AlGaN/GaN multiple channel heterostructures
resolves10.1109/TED.2005.863767Use of double-channel heterostructures to improve the access resistance and linearity in GaN-based HEMTs
resolves10.1109/IEDM.2014.7047033The Super-Lattice Castellated Field Effect Transistor (SLCFET): A novel high performance Transistor topology ideal for RF switching
resolves10.1109/MWSYM.2019.8700845GaN-Based Multi-Channel Transistors with Lateral Gate for Linear and Efficient Millimeter-Wave Power Amplifiers
resolves10.1109/LED.2019.2917285The Super-Lattice Castellated Field-Effect Transistor: A High-Power, High-Performance RF Amplifier
resolves10.1063/1.5064407Multi-channel tri-gate normally-on/off AlGaN/GaN MOSHEMTs on Si substrate with high breakdown voltage and low ON-resistance
resolves10.1109/LED.2020.3038808Conformal Passivation of Multi-Channel GaN Power Transistors for Reduced Current Collapse
resolves10.1063/1.5109389Performance limits of vertical GaN of conventional doped pn and natural polarization superjunction devices
resolves10.1063/1.5142855A unified model for vertical doped and polarized superjunction GaN devices
resolves10.1109/LED.2011.2105242GaN-Based Super Heterojunction Field Effect Transistors Using the Polarization Junction Concept
resolves10.1109/ISPSD.2015.7123442Design and optimization of GaN lateral polarization-doped super-junction (LPSJ): An analytical study
resolves10.1109/LED.2020.3029619Experimental Demonstration of Charge- Balanced GaN Super-Heterojunction Schottky Barrier Diode Capable of 2.8 kV Switching
resolves10.1109/LED.2018.2834939N-Polar GaN HEMTs Exhibiting Record Breakdown Voltage Over 2000 V and Low Dynamic On-Resistance
resolves10.1063/1.2820381Low nonalloyed Ohmic contact resistance to nitride high electron mobility transistors using N-face growth
resolves10.1002/pssc.201100431N‐polar n<sup>+</sup> GaN cap development for low ohmic contact resistance to inverted HEMTs
resolves10.1109/LED.2019.2914026A Demonstration of Nitrogen Polar Gallium Nitride Current Aperture Vertical Electron Transistor
resolves10.1109/TDMR.2008.923743Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives
resolves10.1109/ECCE.2013.6647171Evaluation of 600 V cascode GaN HEMT in device characterization and all-GaN-based LLC resonant converter
resolves10.1109/TPEL.2013.2264941Package Parasitic Inductance Extraction and Simulation Model Development for the High-Voltage Cascode GaN HEMT
resolves10.1063/1.4989599Reduction of on-resistance and current crowding in quasi-vertical GaN power diodes
resolves10.7567/JJAP.52.08JN22Determination of Lateral Extension of Extrinsic Photon Recycling in p-GaN by Using Transmission-Line-Model Patterns Formed with GaN p–n Junction Epitaxial Layers
resolves10.1109/LED.2019.2912395Design and Fabrication of GaN p-n Junction Diodes With Negative Beveled-Mesa Termination
resolves10.1063/1.1978991Growth stresses and cracking in GaN films on (111) Si grown by metal-organic chemical-vapor deposition. I. AlN buffer layers
resolves10.1109/LED.2011.2167125Over 3.0 $\hbox{GW/cm}^{2}$ Figure-of-Merit GaN p-n Junction Diodes on Free-Standing GaN Substrates
resolves10.1063/1.2001738Growth and characterization of GaN PiN rectifiers on free-standing GaN
resolves10.1002/pssa.201000976Over 1.0 kV GaN <i>p</i>–<i>n</i> junction diodes on free‐standing GaN substrates
resolves10.7567/JJAP.52.028007High-Breakdown-Voltage and Low-Specific-on-Resistance GaN p–n Junction Diodes on Free-Standing GaN Substrates Fabricated Through Low-Damage Field-Plate Process
resolves10.1063/1.5052479Investigation of GaN-on-GaN vertical <i>p</i>-<i>n</i> diode with regrown <i>p</i>-GaN by metalorganic chemical vapor deposition
resolves10.1063/1.1914952Characterization of AlGaN∕GaNp-n diodes with selectively regrown n-AlGaN by metal-organic chemical-vapor deposition and its application to GaN-based bipolar transistors
resolves10.1063/1.4937436Near unity ideality factor and Shockley-Read-Hall lifetime in GaN-on-GaN <i>p-n</i> diodes with avalanche breakdown
resolves10.1109/IEDM.2015.7409665GaN-on-GaN p-n power diodes with 3.48 kV and 0.95 mΩ-cm2: A record high figure-of-merit of 12.8 GW/cm2
resolves10.1063/1.4936891High breakdown single-crystal GaN p-n diodes by molecular beam epitaxy
resolves10.1063/1.4919866Design, fabrication, and performance analysis of GaN vertical electron transistors with a buried p/n junction
resolves10.1109/LED.2018.2837625High Performance Vertical GaN-on-GaN p-n Power Diodes With Hydrogen-Plasma-Based Edge Termination
resolves10.1109/LED.2019.2941830Demonstration of 1.27 kV Etch-Then-Regrow GaN ${p}$ -${n}$ Junctions With Low Leakage for GaN Power Electronics
resolves10.1063/1.5035267High voltage, high current GaN-on-GaN p-n diodes with partially compensated edge termination
resolves10.1063/1.125933Investigation of vertical transport in <i>n</i>-GaN films grown by molecular beam epitaxy using Schottky barrier diodes
resolves10.1143/APEX.3.081001Extremely Low On-Resistance and High Breakdown Voltage Observed in Vertical GaN Schottky Barrier Diodes with High-Mobility Drift Layers on Low-Dislocation-Density GaN Substrates
resolves10.1109/ISPSD.2014.6856038Fast recovery performance of vertical GaN Schottky barrier diodes on low-dislocation-density GaN substrates
resolves10.7567/APEX.8.07100150 A vertical GaN Schottky barrier diode on a free-standing GaN substrate with blocking voltage of 790 V
resolves10.1063/1.4943946Improved performance in vertical GaN Schottky diode assisted by AlGaN tunneling barrier
resolves10.1063/1.4941814High-voltage vertical GaN Schottky diode enabled by low-carbon metal-organic chemical vapor deposition growth
resolves10.1063/1.4994627Initial leakage current paths in the vertical-type GaN-on-GaN Schottky barrier diodes
resolves10.7567/JJAP.57.105501Comparing high-purity
<i>c</i>
- and
<i>m</i>
-plane GaN layers for Schottky barrier diodes grown homoepitaxially by metalorganic vapor phase epitaxy
resolves10.1063/1.5087491GaN drift-layer thickness effects in vertical Schottky barrier diodes on free-standing HVPE GaN substrates
resolves10.7567/1347-4065/ab65cdImproved breakdown voltage in vertical GaN Schottky barrier diodes on free-standing GaN with Mg-compensated drift layer
resolves10.1063/1.4993201Ultra-low turn-on voltage and on-resistance vertical GaN-on-GaN Schottky power diodes with high mobility double drift layers
resolves10.1109/LED.2018.2808684High-Voltage and High- $I_{\text {ON}}/I_{\text {OFF}}$ Vertical GaN-on-GaN Schottky Barrier Diode With Nitridation-Based Termination
resolves10.1109/TPEL.2018.2876444Current-Collapse-Free and Fast Reverse Recovery Performance in Vertical GaN-on-GaN Schottky Barrier Diode
resolves10.1109/LED.2019.2915578Fluorine-Implanted Termination for Vertical GaN Schottky Rectifier With High Blocking Voltage and Low Forward Voltage Drop
resolves10.1088/1674-1056/ab7909Fabrication and characterization of vertical GaN Schottky barrier diodes with boron-implanted termination*
resolves10.1109/LED.2008.922982Enhancement and Depletion Mode AlGaN/GaN CAVET With Mg-Ion-Implanted GaN as Current Blocking Layer
resolves10.1109/IEDM.2016.78383851.7 kV/1.0 mΩcm<sup>2</sup>normally-off vertical GaN transistor on GaN substrate with regrown p-GaN/AlGaN/GaN semipolar gate structure
resolves10.1063/1.1641520AlGaN/GaN current aperture vertical electron transistors with regrown channels
resolves10.1109/LED.2011.2173456CAVET on Bulk GaN Substrates Achieved With MBE-Regrown AlGaN/GaN Layers to Suppress Dispersion
resolves10.1109/LED.2014.23391971.5-kV and 2.2-m<inline-formula> <tex-math notation="TeX">\(\Omega \) </tex-math></inline-formula>-cm<inline-formula> <tex-math notation="TeX">\(^{2}\) </tex-math></inline-formula> Vertical GaN Transistors on Bulk-GaN Substrates
resolves10.1109/LED.2018.2828844880 V/$2.7~\text{m}\Omega\cdot\text{cm}^{\text{2}}$ MIS Gate Trench CAVET on Bulk GaN Substrates
resolves10.7567/APEX.8.0541011.8 mΩ·cm<sup>2</sup>vertical GaN-based trench metal–oxide–semiconductor field-effect transistors on a free-standing GaN substrate for 1.2-kV-class operation
resolves10.1109/ISPSD.2016.7520877Over 10 a operation with switching characteristics of 1.2 kV-class vertical GaN trench MOSFETs on a bulk GaN substrate
resolves10.1143/JJAP.46.L599GaN-Based Trench Gate Metal Oxide Semiconductor Field Effect Transistors with Over 100 cm<sup>2</sup>/(V s) Channel Mobility
resolves10.1143/APEX.1.011105Vertical GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistors on GaN Bulk Substrates
resolves10.1143/APEX.1.021104GaN-Based Trench Gate Metal Oxide Semiconductor Field-Effect Transistor Fabricated with Novel Wet Etching
resolves10.7567/APEX.7.021002Vertical GaN-based trench metal oxide semiconductor field-effect transistors on a free-standing GaN substrate with blocking voltage of 1.6 kV
resolves10.1109/LED.2017.2649599In Situ <italic>O</italic>xide, <italic>G</italic>aN Interlayer-Based Vertical Trench MOS<italic>FET</italic> (<italic>OG-FET</italic>) on Bulk GaN substrates
resolves10.1109/IEDM.2017.8268359Demonstrating >1.4 kV OG-FET performance with a novel double field-plated geometry and the successful scaling of large-area devices
resolves10.1109/TED.2017.2716982Instability of Dynamic- $R_{\text ON}$ and Threshold Voltage in GaN-on-GaN Vertical Field-Effect Transistors
resolves10.1038/s41598-019-46186-9Top-down GaN nanowire transistors with nearly zero gate hysteresis for parallel vertical electronics
resolves10.1088/1361-6641/abc5ffVertical 3D gallium nitride field-effect transistors based on fin structures with inverted p-doped channel
resolves10.1063/5.0027922Highly stable threshold voltage in GaN nanowire FETs: The advantages of <i>p</i>-GaN channel/Al2O3 gate insulator
resolves10.7567/APEX.9.111005Novel fully vertical GaN p–n diode on Si substrate grown by metalorganic chemical vapor deposition
resolves10.1109/LED.2018.2819642720-V/0.35-m<inline-formula> <tex-math notation="LaTeX">$\Omega \cdot$ </tex-math> </inline-formula>cm<sup>2</sup>Fully Vertical GaN-on-Si Power Diodes by Selective Removal of Si Substrates and Buffer Layers
resolves10.1109/IEDM.2008.4796635Monolithic integration of lateral field-effect rectifier with normally-off HEMT for GaN-on-Si switch-mode power supply converters
resolves10.1109/LED.2018.2841959Vertical GaN-on-Si MOSFETs With Monolithically Integrated Freewheeling Schottky Barrier Diodes
resolves10.3390/ma13214740Use of Bilayer Gate Insulator in GaN-on-Si Vertical Trench MOSFETs: Impact on Performance and Reliability
resolves10.1149/2.0371602jssSelective p-type Doping of GaN:Si by Mg Ion Implantation and Multicycle Rapid Thermal Annealing
resolves10.1063/1.5116866Highly effective activation of Mg-implanted p-type GaN by ultra-high-pressure annealing
resolves10.1063/1.3285309High-temperature molecular beam epitaxial growth of AlGaN/GaN on GaN templates with reduced interface impurity levels
resolves10.1063/1.114330Hydrogen passivation of Mg acceptors in GaN grown by metalorganic chemical vapor deposition
resolves10.1063/1.117202Local vibrational modes of the Mg–H acceptor complex in GaN
resolves10.7567/APEX.9.121001Comparing electrical performance of GaN trench-gate MOSFETs with a-plane
and m-plane
sidewall channels
resolves10.1063/1.5011327Tutorial: Junction spectroscopy techniques and deep-level defects in
semiconductors
resolves10.1109/16.906451The impact of surface states on the DC and RF characteristics of AlGaN/GaN HFETs
resolves10.1109/16.906437Trapping effects and microwave power performance in AlGaN/GaN HEMTs
resolves10.1109/TED.2006.885681Current Collapse and High-Electric-Field Reliability of Unpassivated GaN/AlGaN/GaN HEMTs
resolves10.1109/TED.2007.901150Suppression of Dynamic On-Resistance Increase and Gate Charge Measurements in High-Voltage GaN-HEMTs With Optimized Field-Plate Structure
resolves10.1109/TED.2013.2274477Methodology for the Study of Dynamic ON-Resistance in High-Voltage GaN Field-Effect Transistors
resolves10.1109/LED.2014.2344439Kinetics of Buffer-Related R<sub>ON</sub>-Increase in GaN-on-Silicon MIS-HEMTs
resolves10.1109/TED.2014.2386391Temperature-Dependent Dynamic <inline-formula> <tex-math notation="LaTeX">$R_{\mathrm {\mathrm{{\scriptstyle ON}}}}$ </tex-math></inline-formula> in GaN-Based MIS-HEMTs: Role of Surface Traps and Buffer Leakage
resolves10.7567/JJAP.50.08KE04Enhancement in Electron Field Emission of Microcrystalline Diamond Films upon Iron Coating and Annealing Processes
resolves10.1063/1.4811754Bulk and interface trapping in the gate dielectric of GaN based metal-oxide-semiconductor high-electron-mobility transistors
resolves10.1109/TED.2013.2274730Fabrication and Performance of Au-Free AlGaN/GaN-on-Silicon Power Devices With ${\rm Al}_{2}{\rm O}_{3}$ and ${\rm Si}_{3}{\rm N}_{4}/{\rm Al}_{2}{\rm O}_{3}$ Gate Dielectrics
resolves10.1109/TED.2017.2686840Unified Mechanism for Positive- and Negative-Bias Temperature Instability in GaN MOSFETs
resolves10.1016/j.mseb.2004.09.001Field dependent transformation of electron traps in GaN p–n diodes grown by metal–organic chemical vapour deposition
resolves10.1038/s41598-019-43583-yFirst observation of electronic trap levels in freestanding GaN crystals extracted from Si substrates by hydride vapour phase epitaxy
resolves10.1002/pssa.201700516Evolution of Electrically Active Defects in n‐GaN During Heat Treatment Typical for Ohmic Contact Formation
resolves10.1116/1.4953347Deep traps and instabilities in AlGaN/GaN high electron mobility transistors on Si substrates
resolves10.1063/1.4905783Proton irradiation effects on deep level states in Mg-doped p-type GaN grown by ammonia-based molecular beam epitaxy
resolves10.7567/JJAP.51.04DF04Deep levels in n-GaN Doped with Carbon Studied by Deep Level and Minority Carrier Transient Spectroscopies
resolves10.1063/1.1586981Electron capture behaviors of deep level traps in unintentionally doped and intentionally doped <i>n</i>-type GaN
resolves10.1007/s11664-007-0313-3Electrically Active Defects in GaN Layers Grown With and Without Fe-doped Buffers by Metal-organic Chemical Vapor Deposition
resolves10.1063/1.357144Analysis of deep levels in <i>n</i>-type GaN by transient capacitance methods
resolves10.1063/1.125622Electrical characterization of isoelectronic In-doping effects in GaN films grown by metalorganic vapor phase epitaxy
resolves10.1063/1.4748170As-grown deep-level defects in n-GaN grown by metal–organic chemical vapor deposition on freestanding GaN
resolves10.1063/1.3491798Deep level transient spectroscopy in plasma-assisted molecular beam epitaxy grown Al0.2Ga0.8N/GaN interface and the rapid thermal annealing effect
resolves10.1063/1.121274Deep centers in n-GaN grown by reactive molecular beam epitaxy
resolves10.1063/1.1557316Observation of inductively coupled-plasma-induced damage on <i>n</i>-type GaN using deep-level transient spectroscopy
resolves10.1002/pssc.200778622Comparison of deep level incorporation in ammonia and rf‐plasma assisted molecular beam epitaxy n‐GaN films
resolves10.1063/1.3453660Impact of N- and Ga-face polarity on the incorporation of deep levels in n-type GaN grown by molecular beam epitaxy
resolves10.1063/1.3094754Photoluminescence studies of impurity transitions in Mg-doped AlGaN alloys
resolves10.1002/pssb.201600364Deep level traps in semi‐polar n‐GaN grown on patterned sapphire substrate by metalorganic vapor phase epitaxy
resolves10.1063/1.1445274Impact of Ga/N flux ratio on trap states in n-GaN grown by plasma-assisted molecular-beam epitaxy
resolves10.1063/1.1697616Influence of high-temperature annealing on the properties of Fe doped semi-insulating GaN structures
resolves10.1063/1.3682528Deep traps in nonpolar m-plane GaN grown by ammonia-based molecular beam epitaxy
resolves10.1063/1.3687700Assessment of deep level defects in <i>m</i>-plane GaN grown by metalorganic chemical vapor deposition
resolves10.1364/OE.20.00A812Quantitative and depth-resolved deep level defect distributions in InGaN/GaN light emitting diodes
resolves10.1063/1.2126145Traps in AlGaN∕GaN∕SiC heterostructures studied by deep level transient spectroscopy
resolves10.1063/1.5022806Spatial correlation of the EC-0.57 eV trap state with edge dislocations in epitaxial n-type gallium nitride
resolves10.7567/1347-4065/ab0408Characterization of hole traps in MOVPE-grown p-type GaN layers using low-frequency capacitance deep-level transient spectroscopy
resolves10.1063/1.121016Deep level defects in <i>n-</i>type GaN grown by molecular beam epitaxy
resolves10.1063/1.115028Effects of column III alkyl sources on deep levels in GaN grown by organometallic vapor phase epitaxy
resolves10.1063/1.4806980Spatially-resolved spectroscopic measurements of <i>Ec</i> − 0.57 eV traps in AlGaN/GaN high electron mobility transistors
resolves10.1063/1.4793196Iron-induced deep-level acceptor center in GaN/AlGaN high electron mobility transistors: Energy level and cross section
resolves10.1007/s11664-007-0202-9Electron and Hole Capture Cross-Sections of Fe Acceptors
in GaN:Fe Epitaxially Grown on Sapphire
resolves10.1103/PhysRevB.55.4382Excited states of<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:msup><mml:mrow><mml:mi mathvariant="normal">Fe</mml:mi></mml:mrow><mml:mrow><mml:mn>3</mml:mn><mml:mo>+</mml:mo></mml:mrow></mml:msup></mml:mrow></mml:math>in GaN
resolves10.1109/IRPS.2012.6241780Direct correlation between specific trap formation and electric stress-induced degradation in MBE-grown AlGaN/GaN HEMTs
resolves10.1063/1.4759037Influence of V/III growth flux ratio on trap states in m-plane GaN grown by ammonia-based molecular beam epitaxy
resolves10.1063/1.4983556Changes in electron and hole traps in GaN-based light emitting diodes from near-UV to green spectral ranges
resolves10.1063/1.5057373The origin of carbon-related carrier compensation in p-type GaN layers grown by MOVPE
resolves10.1063/1.4927405Impact of residual carbon impurities and gallium vacancies on trapping effects in AlGaN/GaN metal insulator semiconductor high electron mobility transistors
resolves10.1063/1.1863458Electrical activation characteristics of silicon-implanted GaN
resolves10.1063/1.112309<i>p</i>-type conduction in Mg-doped GaN and Al0.08Ga0.92N grown by metalorganic vapor phase epitaxy
resolves10.35848/1882-0786/ab9e7cIdentification of origin of <i>E</i> <sub>C</sub> –0.6 eV electron trap level by correlation with iron concentration in n-type GaN grown on GaN freestanding substrate by metalorganic vapor phase epitaxy
resolves10.1109/LED.2004.827283Analysis of Surface Charging Effects in Passivated AlGaN–GaN FETs Using a MOS Test Electrode
resolves10.1109/55.843146The effect of surface passivation on the microwave characteristics of undoped AlGaN/GaN HEMTs
resolves10.1109/IEDM.2001.979574Surface-charge controlled AlGaN/GaN-power HFET without current collapse and gm dispersion
resolves10.1063/1.4723848Degradation of AlGaN/GaN high electron mobility transistors related to hot electrons
resolves10.1063/1.3481412Distribution of donor states on etched surface of AlGaN/GaN heterostructures
resolves10.1063/1.4971409On the origin of interface states at oxide/III-nitride heterojunction interfaces
resolves10.1109/TED.2019.2901869Measurement of the Variable Surface Charge Concentration in Gallium Nitride and Implications on Device Modeling and Physics
resolves10.1063/1.4896900On the origin of the two-dimensional electron gas at AlGaN/GaN heterojunctions and its influence on recessed-gate metal-insulator-semiconductor high electron mobility transistors
resolves10.1109/TED.2010.2069566AlGaN/GaN/GaN:C Back-Barrier HFETs With Breakdown Voltage of Over 1 kV and Low $R_{\scriptscriptstyle{\rm ON}} \times A$
resolves10.1109/LED.2014.2356720Investigation of Surface- and Buffer-Induced Current Collapse in GaN High-Electron Mobility Transistors Using a Soft Switched Pulsed \(I-V\) Measurement
resolves10.1109/TED.2017.2706090“Leaky Dielectric” Model for the Suppression of Dynamic $R_{\mathrm{ON}}$ in Carbon-Doped AlGaN/GaN HEMTs
resolves10.1109/IRPS45951.2020.9128816Trap Dynamics Model Explaining the R<sub>ON</sub> Stress/Recovery Behavior in Carbon-Doped Power AlGaN/GaN MOS-HEMTs
resolves10.1063/1.1418452Current collapse and the role of carbon in AlGaN/GaN high electron mobility transistors grown by metalorganic vapor-phase epitaxy
resolves10.1063/1.2179375Impact of substrate temperature on the incorporation of carbon-related defects and mechanism for semi-insulating behavior in GaN grown by molecular beam epitaxy
resolves10.1116/1.4914316Precursors for carbon doping of GaN in chemical vapor deposition
resolves10.1063/1.2005379Impact of deep levels on the electrical conductivity and luminescence of gallium nitride codoped with carbon and silicon
resolves10.1063/1.4983452A first-principles study of carbon-related energy levels in GaN. I. Complexes formed by substitutional/interstitial carbons and gallium/nitrogen vacancies
resolves10.1109/TED.2016.2593791Experimental and Numerical Analysis of Hole Emission Process From Carbon-Related Traps in GaN Buffer Layers
resolves10.1109/TED.2018.2878770Part I: Physical Insight Into Carbon-Doping-Induced Delayed Avalanche Action in GaN Buffer in AlGaN/GaN HEMTs
resolves10.1002/pssa.201900762The Role of Carbon Doping on Breakdown, Current Collapse, and Dynamic On‐Resistance Recovery in AlGaN/GaN High Electron Mobility Transistors on Semi‐Insulating SiC Substrates
resolves10.1007/s10825-020-01573-8The effects of carbon on the bidirectional threshold voltage instabilities induced by negative gate bias stress in GaN MIS-HEMTs
resolves10.1109/TED.2018.2872552Effect of Carbon Doping on Charging/Discharging Dynamics and Leakage Behavior of Carbon-Doped GaN
resolves10.1116/1.1752907Effect of carbon doping on buffer leakage in AlGaN/GaN high electron mobility transistors
resolves10.35848/1882-0786/ab9623Storage and release of buffer charge in GaN-on-Si HEMTs investigated by transient measurements
resolves10.1109/TED.2018.2850042Performance and <i>V</i>
<sub>TH</sub> Stability in E-Mode GaN Fully Recessed MIS-FETs and Partially Recessed MIS-HEMTs With LPCVD-SiN<sub>
<i>x</i>
</sub>/PECVD-SiN<sub>
<i>x</i>
</sub> Gate Dielectric Stack
resolves10.7567/JJAP.54.044101Investigation of the threshold voltage drift in enhancement mode GaN MOSFET under negative gate bias stress
resolves10.1109/IRPS.2016.7574586Correlation between dynamic Rdsou transients and Carbon related buffer traps in AlGaN/GaN HEMTs
resolves10.7567/JJAP.52.04CF07Effects of Deep Trapping States at High Temperatures on Transient Performance of AlGaN/GaN Heterostructure Field-Effect Transistors
resolves10.1109/TED.2020.3045683“Hole Redistribution” Model Explaining the Thermally Activated <i>R</i>
<sub>ON</sub> Stress/Recovery Transients in Carbon-Doped AlGaN/GaN Power MIS-HEMTs
resolves10.1109/LED.2018.2791664Dependence of ${V}_{\text {TH}}$ Stability on Gate-Bias Under Reverse-Bias Stress in E-mode GaN MIS-FET
resolves10.1109/IEDM.2017.8268489Reverse-bias stability and reliability of hole-barrier-free E-mode LPCVD-SiN<inf>x</inf>/GaN MIS-FETs
resolves10.1109/TED.2016.2539341Toward Understanding Positive Bias Temperature Instability in Fully Recessed-Gate GaN MISFETs
resolves10.1109/TED.2013.2279158On the Origin of Kink Effect in Current–Voltage Characteristics of AlGaN/GaN High Electron Mobility Transistors
resolves10.1109/TED.2013.2248158Broadband Frequency Dispersion Small-Signal Modeling of the Output Conductance and Transconductance in AlInN/GaN HEMTs
resolves10.1088/1674-1056/23/2/027302Kink effect in current—voltage characteristics of a GaN-based high electron mobility transistor with an AlGaN back barrier
resolves10.1109/TED.2018.2872513Evaluation of Pulsed <i>I</i>–<i>V</i> Analysis as Validation Tool of Nonlinear RF Models of GaN-Based HFETs
resolves10.1109/TED.2015.2499313Application Relevant Evaluation of Trapping Effects in AlGaN/GaN HEMTs With Fe-Doped Buffer
resolves10.1063/1.1708872Determination of Deep Centers in Conducting Gallium Arsenide
resolves10.1016/0038-1101(70)90064-XThermal and optical emission and capture rates and cross sections of electrons and holes at imperfection centers in semiconductors from photo and dark junction current and capacitance experiments
resolves10.1063/1.1663719Deep-level transient spectroscopy: A new method to characterize traps in semiconductors
resolves10.1063/1.323120Photocapacitance effects of deep traps in epitaxial GaAs
resolves10.1063/1.126580Optically and thermally detected deep levels in <i>n</i>-type Schottky and p+-n GaN diodes
resolves10.1063/1.4933174Thermal stability of deep level defects induced by high energy proton irradiation in n-type GaN
resolves10.1109/IEDM.2010.5703396Spatially-discriminating trap characterization methods for HEMTs and their application to RF-stressed AlGaN/GaN HEMTs
resolves10.1109/TED.2013.2279021Deep-Level Characterization in GaN HEMTs-Part I: Advantages and Limitations of Drain Current Transient Measurements
resolves10.1088/1361-6641/abc456Understanding the effects of off-state and hard-switching stress in gallium nitride-based power transistors
resolves10.1109/TED.2010.2087339A Current-Transient Methodology for Trap Analysis for GaN High Electron Mobility Transistors
resolves10.1109/LED.2010.2047092Integrated Optical and Electrical Analysis: Identifying Location and Properties of Traps in AlGaN/GaN HEMTs During Electrical Stress
resolves10.1109/IRPS.2012.6241881Experimental and numerical correlation between current-collapse and fe-doping profiles in GaN HEMTs
resolves10.1109/TED.2013.2278290Deep Levels Characterization in GaN HEMTs—Part II: Experimental and Numerical Evaluation of Self-Heating Effects on the Extraction of Traps Activation Energy
resolves10.1063/1.1719264Poole-Frenkel electron emission from the traps in AlGaN/GaN transistors
resolves10.1016/j.mssp.2017.10.029Evolution of on-resistance (RON) and threshold voltage (VTH) in GaN HEMTs during switch-mode operation
resolves10.1016/0038-1101(62)90111-9An investigation of surface states at a silicon/silicon oxide interface employing metal-oxide-silicon diodes
resolves10.12816/0048929Capacitance–Frequency (C-V-F) and Conductance–Frequency (G-V-F) Characteristics of Au/N-Gan Freestanding Schottky Structure
resolves10.1063/1.4750481Investigation of temperature dependent threshold voltage variation of Gd2O3/AlGaN/GaN metal-oxide-semiconductor heterostructure
resolves10.1088/0256-307X/34/9/097301Characterization of Interface State Density of Ni/p-GaN Structures by Capacitance/Conductance-Voltage-Frequency Measurements
resolves10.1049/el:20010403C-V and G-V characterisation of Ga
<sub>2</sub>
O
<sub>3</sub>
(Gd
<sub>2</sub>
O
<sub>3</sub>
)/GaNcapacitor with low interface state density
resolves10.1016/j.mee.2013.03.108Capacitance–voltage characterization of surface-treated Al2O3/GaN metal–oxide–semiconductor structures
resolves10.1109/EDSSC.2018.8487160Characterization of Transient Threshold Voltage Shifts in Enhancement- and Depletion-mode AlGaN/GaN Metal-Insulator-Semiconductor (MIS)-HEMTs
resolves10.1063/1.2924334Effects of interface states and temperature on the C-V behavior of metal/insulator/AlGaN/GaN heterostructure capacitors
resolves10.1063/1.4905945Modeling small-signal response of GaN-based metal-insulator-semiconductor high electron mobility transistor gate stack in spill-over regime: Effect of barrier resistance and interface states
resolves10.1063/1.3224852Photoassisted high-frequency capacitance-voltage characterization of the Si3N4/GaN interface
resolves10.3390/ma6031050Photoluminescence Study of Gallium Nitride Thin Films Obtained by Infrared Close Space Vapor Transport
resolves10.1109/IRPS.2014.6861129Electrical characterization and reliability analysis of Al<inf>2</inf>O<inf>3</inf>/AlGaN/GaN MISH structure
resolves10.1109/IRPS.2015.7112769Time dependent dielectric breakdown (TDDB) evaluation of PE-ALD SiN gate dielectrics on AlGaN/GaN recessed gate D-mode MIS-HEMTs and E-mode MIS-FETs
resolves10.1063/1.4935223Investigation of gate-diode degradation in normally-off p-GaN/AlGaN/GaN high-electron-mobility transistors
resolves10.1109/ISPSD.2019.8757574Temperature-Dependent Gate Degradation of $p$-GaN Gate HEMTs under Static and Dynamic Positive Gate Stress
resolves10.1063/1.5109301Positive temperature dependence of time-dependent breakdown of GaN-on-Si E-mode HEMTs under positive gate stress
resolves10.1109/TED.2019.2924675Frequency- and Temperature-Dependent Gate Reliability of Schottky-Type ${p}$ -GaN Gate HEMTs
resolves10.1109/LED.2016.2535133Gate Reliability Investigation in Normally-Off p-Type-GaN Cap/AlGaN/GaN HEMTs Under Forward Bias Stress
resolves10.3390/mi5030570Reliability Investigation of GaN HEMTs for MMICs Applications
resolves10.1109/LED.2015.2474116Hot-Electron Degradation of AlGaN/GaN High-Electron Mobility Transistors During RF Operation: Correlation With GaN Buffer Design
resolves10.1109/TED.2015.2446032Extensive Investigation of Time-Dependent Breakdown of GaN-HEMTs Submitted to OFF-State Stress
resolves10.1109/TED.2018.28024492DEG Retraction and Potential Distribution of GaN–on–Si HEMTs Investigated Through a Floating Gate Terminal
resolves10.1063/1.125560Extensional piezoelectric coefficients of gallium nitride and aluminum nitride
resolves10.1109/IEDM.2008.4796725Impact of electrical degradation on trapping characteristics of GaN high electron mobility transistors
resolves10.1109/LED.2008.917815Critical Voltage for Electrical Degradation of GaN High-Electron Mobility Transistors
resolves10.1109/TDMR.2010.2103314Electric-Field-Driven Degradation in off-State Step-Stressed AlGaN/GaN High-Electron Mobility Transistors
resolves10.1063/1.3446869Evolution of structural defects associated with electrical degradation in AlGaN/GaN high electron mobility transistors
resolves10.1063/1.3665065Role of oxygen in the OFF-state degradation of AlGaN/GaN high electron mobility transistors
resolves10.1109/TED.2013.2293114Impact of Water-Assisted Electrochemical Reactions on the OFF-State Degradation of AlGaN/GaN HEMTs
resolves10.1063/1.4881637Time evolution of off-state degradation of AlGaN/GaN high electron mobility transistors
resolves10.1109/IEDM.2010.5703398A comprehensive reliability investigation of the voltage-, temperature- and device geometry-dependence of the gate degradation on state-of-the-art GaN-on-Si HEMTs
resolves10.1109/LED.2016.2543805Experimental Demonstration of Time-Dependent Breakdown in GaN-Based Light Emitting Diodes
resolves10.3390/mi11010101Vertical Leakage in GaN-on-Si Stacks Investigated by a Buffer Decomposition Experiment
resolves10.1109/TED.2020.2964060Modeling of the Vertical Leakage Current in AlN/Si Heterojunctions for GaN Power Applications
resolves10.1063/1.5099245Experimental determination of impact ionization coefficients of electrons and holes in gallium nitride using homojunction structures
resolves10.1063/1.5031785Experimental characterization of impact ionization coefficients for electrons and holes in GaN grown on bulk GaN substrates
resolves10.1109/IEDM19573.2019.8993438Impact Ionization Coefficients in GaN Measured by Above- and Sub-E<sub>g</sub> Illuminations for p<sup>−</sup>/n<sup>+</sup> Junction
resolves10.1109/IRPS.2014.6861112Current collapse in GaN heterojunction field effect transistors for high-voltage switching applications
resolves10.1016/j.microrel.2020.113830A novel on-wafer approach to test the stability of GaN-based devices in hard switching conditions: Study of hot-electron effects
resolves10.1049/iet-pel.2019.1455Fast System to measure the dynamic on‐resistance of on‐wafer 600 V normally off GaN HEMTs in hard‐switching application conditions
resolves10.1109/LED.2011.2181815Time- and Field-Dependent Trapping in GaN-Based Enhancement-Mode Transistors With p-Gate
resolves10.1049/iet-pel.2017.0403Review of dynamic effects and reliability of depletion and enhancement GaN HEMTs for power switching applications
resolves10.1109/TED.2018.2881325The Effect of Proton Irradiation in Suppressing Current Collapse in AlGaN/GaN High-Electron-Mobility Transistors
resolves10.1109/TNS.2004.825077The Energy Dependence of Proton-Induced Degradation in AlGaN/GaN High Electron Mobility Transistors
resolves10.1116/1.4788904Dependence on proton energy of degradation of AlGaN/GaN high electron mobility transistors
resolves10.1109/TNS.2003.821827Electrical, spectral, and chemical properties of 1.8 MeV proton irradiated AlGaN/GaN HEMT structures as a function of proton fluence
resolves10.1109/TNS.2004.839199Proton irradiation effects on GaN-based high electron-mobility transistors with Si-doped Al/sub x/Ga/sub 1-x/N and thick GaN cap Layers
resolves10.1063/1.1408606dc and rf performance of proton-irradiated AlGaN/GaN high electron mobility transistors
resolves10.1063/1.4922286Band gap bowing parameter in pseudomorphic Al<i>x</i>Ga1−<i>x</i>N/GaN high electron mobility transistor structures
resolves10.1063/1.1445809Influence of Co60 γ-rays on dc performance of AlGaN/GaN high electron mobility transistors
resolves10.1080/10420150.2015.1010170Low and moderate dose gamma-irradiation and annealing impact on electronic and electrical properties of AlGaN/GaN high electron mobility transistors
resolves10.1063/1.4792240Gamma irradiation impact on electronic carrier transport in AlGaN/GaN high electron mobility transistors
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