Reference health
Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT
14/14 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
5 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 14 checked references that resolve
resolves10.1115/IPACK2011-52047
Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
resolves10.1115/IPACK2003-35228
A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly
resolves10.1115/1.2804093
Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
resolves10.1109/ICIP.2007.4379858
Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
resolves10.1109/EPTC.2009.5416570
X-ray computed tomography on miniaturized solder joints for nano packaging
resolves10.1115/IPACK2005-73109
Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures
resolves10.1109/ECTC.2012.6248879
Improved predictions of lead free solder joint reliability that include aging effects
resolves10.1115/1.1525820
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System
resolves10.1109/TCAPT.2002.1010010
Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects
The 5 references without a DOI — listed, not checked
no DOI — not checkedAddressing the challenge of head-in-pillow defects in electronics assembly
no DOI — not checkedHIP defects in BGAs
no DOI — not checkedX-ray nanoCT of interconnections in IC packages: Visualizing of internal 3D-Structures with Submicrometer Resolution
no DOI — not checked5
no DOI — not checkedX-Ray inspection of micro-wire bonds
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
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