Reference health
Study on Bonding Strength of Sintered Nano-silver Joints on Bare Copper Substrates with Different Grain Sizes
8/8 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 8 checked references that resolve
resolves10.1016/j.microrel.2011.07.088
Low-temperature low-pressure die attach with hybrid silver particle paste
resolves10.1109/TEPM.2002.807719
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
resolves10.1016/j.jallcom.2016.06.132
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C
resolves10.1002/ceat.200500139
Hydrogenations over Silver: A Highly Active and Chemoselective Ag‐In/SiO<sub>2</sub> Catalyst for the One‐Step Synthesis of Allyl Alcohol from Acrolein
resolves10.1016/j.jallcom.2014.08.062
Microstructure evolution during 300 °C storage of sintered Ag nanoparticles on Ag and Au substrates
resolves10.1007/s11664-014-3202-6
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
resolves10.1016/j.jallcom.2011.10.092
Mechanical properties of nano-silver joints as die attach materials
resolves10.1016/j.microrel.2007.07.102
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device
The 3 references without a DOI — listed, not checked
no DOI — not checkedElectron Microscopy and Catalytic Study of Silver Catalysts: Structure Sensitivity of the Hydrogenation of Crotonaldehyde
no DOI — not checkedProcessing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
no DOI — not checkedDie-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
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