Reference health
Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications
9/9 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 9 checked references that resolve
resolves10.1115/1.4039264
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
resolves10.1016/j.ijheatmasstransfer.2017.10.015
A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
resolves10.1115/IPACK2019-6400
Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa
resolves10.1109/ITHERM.2019.8757391
Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps - R245fa Empirical Results
resolves10.1115/IPACK2019-6472
Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling
resolves10.1016/j.ijheatmasstransfer.2012.07.073
Numerical investigation and sensitivity analysis of manifold microchannel coolers
resolves10.1016/j.ijheatmasstransfer.2018.10.108
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
The 2 references without a DOI — listed, not checked
no DOI — not checkedHigh Aspect Ratio Deep Si etching recipe development for Silicon based large area 3D-manifolded embedded micro-cooler devices for high heat flux removal
no DOI — not checkedA Metamodelilng Approach for Optimization of Manifold Microchannel Systems for High Heat Flux Cooling Applications
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