Reference health
Cooling a Microprocessor Chip
18/18 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
7 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 18 checked references that resolve
resolves10.1016/S0026-2714(01)00129-9
Characterization of solder interfaces using laser flash metrology
resolves10.1109/ITHERM.2000.866807
The development of a tool to predict package level thermal interface material performance
resolves10.1109/STHERM.1997.566783
Thermal modeling of grease-type interface material in PPGA application
resolves10.1109/TADVP.2004.830354
SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade
resolves10.1109/TCAPT.2002.807994
Spreading in the heat sink base: phase change systems or solid metals??
resolves10.1103/PhysRevLett.94.025901
Thermal Conductivity of Nanoscale Colloidal Solutions (Nanofluids)
resolves10.1109/IEDM.2004.1419253
A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm/sub 2/ SRAM cell
resolves10.1109/TADVP.2005.858439
Density factor approach to representing impact of die power maps on thermal management
resolves10.1109/ITHERM.2000.866808
Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces
resolves10.1038/35098012
Thin-film thermoelectric devices with high room-temperature figures of merit
resolves10.1109/ITHERM.2002.1012431
Heat rejection limits of air cooled plane fin heat sinks for computer cooling
resolves10.1115/IPACK2005-73243
Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling
resolves10.1109/JSSC.2005.859894
The Implementation of a 2-Core, Multi-Threaded Itanium Family Processor
The 7 references without a DOI — listed, not checked
no DOI — not checkedan accelerated reliability test method to predict thermal grease pump-out in flip-chip applications
no DOI — not checkedref14
no DOI — not checkedref3
no DOI — not checkeda testing apparatus for thermal interface materials
no DOI — not checkedthermal performance challenges from silicon to systems
no DOI — not checkedmicrofabrication alliance for innovative cooling of microelectronics
no DOI — not checkedvapor compression cooling for high performance applications
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-23 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
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