Reference health
Defect Detection of Flip Chip Solder Bumps With Wavelet Analysis of Laser Ultrasound Signals
18/18 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
4 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 18 checked references that resolve
resolves10.1109/TADVP.2005.850508
Determination of Measurement Limit for Open Solder Bumps on a Flip-Chip Package Using a Laser Ultrasonic Inspection System
resolves10.1109/6040.826765
Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing
resolves10.1109/ULTSYM.2004.1417956
Ultrasonic flaw detection using discrete wavelet transform for NDE applications
resolves10.1016/j.matdes.2004.02.010
Non-contact ultrasonic inspection of medical catheters for polymeric bond defects
resolves10.1109/95.465169
Nondestructive detection of defects in miniaturized multilayer ceramic capacitors using digital speckle correlation techniques
resolves10.1016/j.compstruct.2003.09.038
Detection of internal delamination in multi-layer composites using wavelet packets combined with modal parameter analysis
resolves10.1109/TCAPT.2005.848567
Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals
resolves10.1109/6144.974950
A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system
resolves10.1115/1.1525820
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System
resolves10.1115/1.1464878
Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection
resolves10.1016/S0026-2714(00)00160-8
Flip chips and acoustic micro imaging: An overview of past applications, present status, and roadmap for the future
resolves10.1109/34.192463
A theory for multiresolution signal decomposition: the wavelet representation
resolves10.1109/TITB.2004.828882
Embolic Doppler Ultrasound Signal Detection Using Discrete Wavelet Transform
resolves10.1109/TIM.2002.1017721
Classification of washing machines vibration signals using discrete wavelet analysis for feature extraction
The 4 references without a DOI — listed, not checked
no DOI — not checkedinspection of flip chip scale package interconnection using laser ultrasound and interferometer techniques
no DOI — not checkedref8
no DOI — not checkeddefects pattern recognition for flip chip solder joint quality inspection
no DOI — not checkedx-ray inspection of ic packages and pwbs
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or importance of the work itself, and nothing about references deposited without a DOI.
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