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High thermal conductivity silicon nitride ceramics prepared by pressureless sintering with ternary sintering additives

https://doi.org/10.1111/ijac.13220
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27/27 checkable references clean · checked 2026-07-22

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

3 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 27 checked references that resolve
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Development of high-thermal-conductivity silicon nitride ceramics
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Densification, Mass Loss, and Mechanical Properties of Low‐Temperature Pressureless‐Sintered Si <sub>3</sub> N <sub>4</sub> with LiYO <sub>2</sub> Additive: The Effects of Additive Content and Annealing
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Potential use of only Yb<sub>2</sub>O<sub>3</sub>in producing dense Si<sub>3</sub>N<sub>4</sub>ceramics with high thermal conductivity by gas pressure sintering
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The 3 references without a DOI — listed, not checked
no DOI — not checkedPressureless‐sintering of reaction bonded silicon nitride containing cordierite
no DOI — not checkedChemical Approach to Glass: Glass Science and Technology
no DOI — not checkedSilicon nitride ceramics with high thermal conductivity and excellent mechanical properties fabricated with MgF2 sintering aid and post‐sintering heat treatment
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