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Thermal Conductivity of ß‐Si3N4: I, Effects of Various Microstructural Factors
15/15 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 15 checked references that resolve
resolves10.1002/9780470314715.ch52
Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing
resolves10.1007/BF00738642
Effect of phase composition and microstructure on the thermal diffusivity of silicon nitride
resolves10.2109/jcersj1950.94.1090_595
Thermal Conductivity of Reaction Bonded Si<sub>3</sub>N<sub>4</sub>
resolves10.2109/jcersj.97.174
Temperature Dependence of Thermal Coefficients for HIPped Silicon Nitride
resolves10.1111/j.1151-2916.1996.tb09002.x
High Thermal Conductivity in Silicon Nitride with Anisotropie Microstructure
resolves10.1557/JMR.1999.0206
Hot Isostatic Pressing to Increase Thermal Conductivity of Si<sub>3</sub>N<sub>4</sub> Ceramics
resolves10.1111/j.1151-2916.1996.tb08721.x
Thermal Conductivity of Gas‐Pressure‐Sintered Silicon Nitride
resolves10.1016/0955-2219(93)90102-W
Microstructure and thermal conductivity of AlN(Y2O3) ceramics sintered in different atmospheres
resolves10.1111/j.1151-2916.1996.tb08549.x
Morphological Effect of Second Phase on the Thermal Conductivity of AIN Ceramics
resolves10.1111/j.1151-2916.1977.tb14089.x
Grain Boundary Phases in a Hot‐Pressed MgO Fluxed Silicon Nitride
resolves10.1111/j.1151-2916.1973.tb12401.x
Relation Between Strength, Fracture Energy, and Microstructure of Hot‐Pressed Si
<sub>3</sub>
N
<sub>4</sub>
resolves10.1016/0022-0248(94)90509-6
Relations between crystal structure and growth morphology of β-Si3N4
resolves10.1111/j.1151-2916.1991.tb06914.x
Phase Composition, Oxygen Content, and Thermal Conductivity of AIN(Y
<sub>2</sub>
O
<sub>3</sub>
) Ceramics
The 7 references without a DOI — listed, not checked
no DOI — not checkedThermal Diffusivity, Specific Heat, and Thermal Conductivity of Chemically Vapor‐Deposited Si3N4
no DOI — not checkedThermal Conductivity of Hot‐Pressed Si3N4 by Laser‐Flash Method
no DOI — not checkedThermal Conductivity and Microhardness of Si3N4 with and without Additives
no DOI — not checkedT.Hayashi M.Tamura T.Hirao T.Ohashi andS.Hori “Silicon Nitride of High Thermal Conductivity ” Jpn. Pat. No. 63‐86872 Apr.1988.
no DOI — not checkedLamellare Doppelbrechung
no DOI — not checkedThermal Conductivity of Ceramic Refractory Materials; Calculation from Thermal Conductivities of Constituents
no DOI — not checkedIntroduction to Ceramics
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