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Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling

https://doi.org/10.1115/1.4047883
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9/9 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

12 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 9 checked references that resolve
resolves10.1109/EDL.1981.25367
High-performance heat sinking for VLSI
resolves10.1016/j.ijheatmasstransfer.2018.05.127
Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
resolves10.1016/j.ijheatmasstransfer.2018.10.108
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
resolves10.1080/10407782.2010.529036
Combined Numerical Optimization and Constructal Theory for the Design of Microchannel Heat Sinks
resolves10.1016/j.applthermaleng.2015.10.133
Heat transfer and pressure drop characteristics of a flat plate manifold microchannel heat exchanger in counter flow configuration
resolves10.1016/j.ijheatmasstransfer.2014.10.022
Numerical modeling and thermal optimization of a single-phase flow manifold-microchannel plate heat exchanger
resolves10.1108/09615530510571921
Analysis and optimization of the thermal performance of microchannel heat sinks
resolves10.1016/j.ijheatmasstransfer.2013.09.067
Manifold microchannel heat sink design using optimization under uncertainty
resolves10.1115/1.4004089
Manifold Design for Micro-Channel Cooling With Uniform Flow Distribution
The 12 references without a DOI — listed, not checked
no DOI — not checkedCetegen, E., 2010, “ Force Fed Microchannel High Heat Flux Cooling Utilizing Microgrooved Surfaces,” Ph.D. dissertation, University of Maryland, College Park, MD.https://drum.lib.umd.edu/handle/1903/10286
no DOI — not checkedEvaporative Intrachip Hotspot Cooling With a Hierarchical Manifold Microchannel Heat Sink Array
no DOI — not checkedMicrochannel Cooling Strategies for High Heat Flux (1 kW/cm2) Power Electronic Applications
no DOI — not checkedThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs)—Part 1: Experimental Study of Single-Phase Cooling Performance With R-245fa
no DOI — not checkedNumerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
no DOI — not checkedOptimization of a Microchannel Heat Sink With Temperature Dependent Fluid Properties
no DOI — not checkedThermofluidics and Energetics of a Manifold Microchannel Heat Sink for Electronics With Recovered Hot Water as Working Fluid
no DOI — not checkedValidation of the Porous-Medium Approach to Model Interlayer-Cooled 3D-Chip Stacks
no DOI — not checkedExperimental Study of Single-Phase Cooling With DI Water in an Embedded Microchannels-3D Manifold Cooler
no DOI — not checkedThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs)—Part 3: Addressing Challenges in Laser Micro-Machining Based Manufacturing of 3D-Manifolded Micro-Cooler Devices
no DOI — not checkedFundamentals of Heat and Mass Transfer
no DOI — not checkedFluid Mechanics
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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