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On-Wafer Characterization of Thermomechanical Properties of Isotropic Thin Films Deposited on Anisotropic Substrates
13/13 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 13 checked references that resolve
resolves10.1063/1.340471
Fracture testing of silicon microelements <i>i</i>
<i>n</i> <i>s</i>
<i>i</i>
<i>t</i>
<i>u</i> in a scanning electron microscope
resolves10.1016/S0304-3991(02)00089-X
Mechanical property measurements of nanoscale structures using an atomic force microscope
resolves10.1063/1.98460
Microfabricated structures for the <i>i</i>
<i>n</i> <i>s</i>
<i>i</i>
<i>t</i>
<i>u</i> measurement of residual stress, Young’s modulus, and ultimate strain of thin films
resolves10.1016/S0040-6090(03)00645-X
Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film
resolves10.1063/1.370146
Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
resolves10.1063/1.372054
Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates
resolves10.1016/S0040-6090(97)00926-7
A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering
The 5 references without a DOI — listed, not checked
no DOI — not checked[11]
no DOI — not checked[13]
no DOI — not checked[15]
no DOI — not checked[17]
no DOI — not checked[18]
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