Reference health
Effects of boron and silicon on microstructure and isothermal solidification during TLP bonding of a duplex stainless steel using two Ni–Si–B insert alloys
30/30 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
7 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 30 checked references that resolve
resolves10.1179/mst.1988.4.1.78
Duplex and high alloy stainless steels – corrosion resistance and weldability
resolves10.1016/S1359-6462(03)00045-9
Study of Ni–Cr–Co–W–Mo–B interlayer alloy and its bonding behaviour for a Ni-base single crystal superalloy
resolves10.1179/174329304X8702
Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy
resolves10.1016/j.msea.2005.01.055
Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy
resolves10.1016/j.msea.2006.02.030
Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni–Si–B filler metal
resolves10.1016/j.msea.2005.10.056
Influence of process parameters on microstructure of transient liquid phase bonded Inconel 738LC superalloy with Amdry DF-3 interlayer
resolves10.1016/j.jallcom.2007.06.066
High temperature diffusion induced liquid phase joining of a heat resistant alloy
resolves10.1016/j.matchar.2007.08.023
Joining of superalloy Inconel 600 by diffusion induced isothermal solidification of a liquated insert metal
resolves10.1007/s11661-008-9588-0
Microstructural Evolution in the Transient-Liquid-Phase Bonding Area of IN-738LC/BNi-3/IN-738LC
resolves10.1179/174328408X281877
Solute redistribution during transient liquid phase bonding of IN738LC with BNi-3 interlayer
resolves10.1179/174328408X293478
Transient liquid phase bonding of dissimilar nickel base superalloys — wettability, microstructure and mechanical properties
resolves10.1179/174328408X281958
On deviation from parabolic behaviour during transient liquid phase bonding
resolves10.1016/j.msea.2007.05.069
Variation in diffusion-induced solidification rate of liquated Ni–Cr–B insert during TLP bonding of Waspaloy superalloy
resolves10.1179/026708302225001697
Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers
resolves10.1016/S0921-5093(02)00911-5
Cooling rate effect on vacuum brazed joint properties for 2205 duplex stainless steels
resolves10.1016/j.msea.2004.01.023
Effect of transient liquid-phase bonding variables on the properties of a micro-duplex stainless steel
resolves10.1016/j.matchar.2009.03.004
Microstructure and XRD analysis of brazing joint for duplex stainless steel using a Ni–Si–B filler metal
resolves10.1016/j.matchar.2009.05.012
Characterization of transient-liquid-phase-bonded joints in a duplex stainless steel with a Ni–Cr–B insert alloy
resolves10.1179/mst.1991.7.12.1143
Influence of isothermal solidification on microstructural development in Ni–Si–B filler metals
resolves10.2355/isijinternational.35.1298
Transient Liquid Phase Bonding of Ni-base Single Crystal Superalloy, CMSX-2.
resolves10.1007/BF01352207
The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickel
resolves10.1023/A:1017513200502
Evaluation of transient liquid phase bonding between nickel-based superalloys
resolves10.1016/0956-7151(91)90012-P
The non-equilibrium segregation of boron during the recrystalization of Nb-treated HSLA steels
resolves10.1016/j.jallcom.2007.07.108
Microstructure development during transient liquid phase bonding of GTD-111 nickel-based superalloy
resolves10.1007/BF02649282
A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
The 7 references without a DOI — listed, not checked
no DOI — not checkedbibr3-026708310X12668415533847
no DOI — not checkedHumpston G, Jacobson DM: ‘Principles of soldering and brazing’, 128–132; 1993, Materials Park, OH, ASM International.
no DOI — not checkedbibr25-026708310X12668415533847
no DOI — not checkedMassalski TB: ‘Binary alloy phase diagrams’, 370, 385, 822, 1086; 1986, Metals Park, OH, ASM.
no DOI — not checkedbibr31-026708310X12668415533847
no DOI — not checkedJapan Metal Society: ‘Metal data book’, 92; 1984, Tokyo, Maruzen.
no DOI — not checkedThe Japan Institute of Metals: ‘Metals data book’, 21; 1993, Tokyo, Maruzen.
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