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Formation of eutectic-type microconstituent during transient liquid phase bonding of nickel: Influence of process parameters

https://doi.org/10.1179/174328407x185929
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14/14 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

9 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 14 checked references that resolve
resolves10.1016/j.scriptamat.2006.02.044
Heat affected zone microfissuring in a laser beam welded directionally solidified Ni3Al-base alloy
resolves10.1007/s11661-006-0013-2
Study of the fusion zone and heat-affected zone microstructures in tungsten inert gas-welded INCONEL 738LC superalloy
resolves10.1179/136217104225017099
Nickel based superalloy welding practices for industrial gas turbine applications
resolves10.1016/0924-0136(95)02103-5
Strength and microstructure of brazed cemented carbide and silicon nitride joints
resolves10.1179/mst.1985.1.8.608
Role of brazing in repair of superalloy components – advantages and limitations
resolves10.1007/s11661-000-0114-2
Transient liquid-phase bonding in two-phase ternary systems
resolves10.1361/105497199770335721
Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
resolves10.1007/BF02868996
The B−Cr (Boron-Chromium) system
resolves10.1007/BF02586111
Microstructural study of transient liquid phase bonded cast INCONEL 738LC superalloy
resolves10.1023/A:1010914813875
Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding
resolves10.1179/174329304X8702
Isothermal solidification during transient liquid phase bonding of Inconel 738 superalloy
resolves10.1179/imr.1995.40.5.181
Modelling of transient liquid phase bonding
resolves10.1007/BF02649282
A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
resolves10.2355/isijinternational.35.1298
Transient Liquid Phase Bonding of Ni-base Single Crystal Superalloy, CMSX-2.
The 9 references without a DOI — listed, not checked
no DOI — not checkedDemo W. A., and Ferrigno S. J.: Adv. Mater. Process., 1992, 141, 43.
no DOI — not checkedLugscheider E., and Broich U.: Weld. J., 1995, 74, 169s–176s.
no DOI — not checkedLugsscheider E. Schmoor H. and Eritt U.: ‘Brazing high temperature brazing and diffusion welding’ 259-261; 1995 Duesseldorf Deutscher Verlag fur Schweisstechnik GmbH.
no DOI — not checkedDuvall D. S. Owczarski W. A. and Paulonis D. F.: Weld. 1 1974 53 203s-214s.
no DOI — not checkedGale W. F., and Wallach E. R.: Mater. Sci. Eng., 1991, 7, 1143–1148.
no DOI — not checkedRamirez J. E. and Liu S.: Weld 1 1992 71 365s.
no DOI — not checkedLiu S., , Olson D. L., , Martin G. P., and Edwards G. R.: Weld J., 1991, 70, 207s–215s.
no DOI — not checkedCrank J.: ‘The mathematics of diffusion’ 2nd edn 37; 1975 Oxford Oxford University Press.
no DOI — not checkedMoelwyn-Hughes E. A.: ‘The kinetics of reaction in solution’ 374; 1947 Oxford Clarredon Press.
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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