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Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal

https://doi.org/10.1361/105497199770335721
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13/13 checkable references clean · checked 2026-07-23

Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.

8 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.

The 13 checked references that resolve
resolves10.1007/BF02649282
A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
resolves10.1007/BF02665011
Microstructural development in transient liquid-phase bonding
resolves10.1007/s11661-997-0056-z
Experimental study of the kinetics of transient liquid phase solidification reaction in electroplated gold-tin layers on copper
resolves10.2207/qjjws.7.367
Study on trasient liquid insert metal diffusion bonding of Ni base superalloys. (Part 3). Metallurgical study of TLIM bonding.
resolves10.2207/qjjws.9.415
Influence of Delta-ferrite on Sensitization of the Austenitic Stainless Steel Weld Metal.
resolves10.1007/BF02656822
Modeling of base metal dissolution behavior during transient liquid-phase brazing
resolves10.1016/S1359-6454(96)00188-7
A diffusional model for transient liquid phase bonding
resolves10.1016/0364-5916(85)90021-5
The Thermo-Calc databank system
resolves10.1007/BF02667375
Effect of grain boundaries on isothermal solidification during transient liquid phase brazing
resolves10.1007/BF02651768
Liquid- solid interface migration at grain boundary regions during transient liquid phase brazing
resolves10.1007/BF01352207
The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickel
resolves10.2320/jinstmet1952.58.7_810
Factors Affecting Isothermal Solidification during Transient Liquid Phase-Brazing of Nickel
The 8 references without a DOI — listed, not checked
no DOI — not checkedD.S. Duvall, W.A. Owczarski, and D.F. Paulonis, Weld. J., Vol 53, 1974, p 203
no DOI — not checkedJ.T. Nieman and R.A. Garret, Weld. J., Res. Supp., Vol 53, 1974, p 175
no DOI — not checkedR.R. Wells, Weld. J., Res. Supp., Vol 53, 1976, p 20
no DOI — not checkedE.A. Moelwyn-Hughes, The Kinetics of Reaction in Solution, Claredon Press, 1974, p 374
no DOI — not checkedY. Nakao, K. Nishimoto, K. Shinozuka, K.C. Yun, and Y. Hori, Trans. Jpn. Weld. Soc., 1988, p 513
no DOI — not checkedKinzoku Data Book, Japan Institute of Metals, 1983
no DOI — not checkedA. Majidic, D. Graf, and H. Schenek, Arch. Eisenhüttenwes., Vol 40, 1966, p 27
no DOI — not checkedE. Scheil, Z. Metallkd., Vol 34, 1942, p 70
What this badge says. CiteStamped means the CHECKABLE references of this work were clean at the dated check: each resolved to a known work in a public registry, and none carried a retraction notice at that time. It says nothing about the quality, findings, or importance of the work itself, and nothing about references deposited without a DOI.

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