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Effect of Microstructure on the Thermal Properties of Sintered Iron-copper Composites
14/14 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 14 checked references that resolve
resolves10.1016/j.materresbull.2013.07.064
Fabrication and thermal conductivity of copper matrix composites reinforced with Mo2C or TiC coated graphite fibers
resolves10.1016/j.jpcs.2011.11.033
Effect of porosity on the thermal conductivity of copper processed by powder metallurgy
resolves10.1016/j.jmatprotec.2004.03.025
Modelling of swelling of Fe–Cu compacts sintered at temperatures above the copper melting point
resolves10.1007/s00339-013-7839-4
Novel Cu–Cr alloy matrix CNT composites with enhanced thermal conductivity
resolves10.1007/s12541-014-0459-x
Preparation and characterization of copper/copper coated silicon carbide composites
resolves10.1007/s10853-011-6180-6
Interfacial characterization and thermal conductivity of diamond/Cu composites prepared by two HPHT techniques
resolves10.1007/s11665-013-0780-z
Improved Thermal Performance of Diamond-Copper Composites with Boron Carbide Coating
resolves10.1007/s10973-013-3604-3
Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive
resolves10.1007/s11837-998-0128-6
Advances in composite materials for thermal management in electronic packaging
resolves10.1016/j.ijheatmasstransfer.2006.02.007
A new approach to modelling the effective thermal conductivity of heterogeneous materials
resolves10.1063/1.1728417
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
resolves10.1016/j.commatsci.2009.09.018
Multicomponent and multiphase simulation of liquid-phase sintering
The 5 references without a DOI — listed, not checked
no DOI — not checkedref1
no DOI — not checkedref11
no DOI — not checkedTheory of thermal conductivity
no DOI — not checkedref16
no DOI — not checkedref19
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