Reference health
Direct Cooling of a Planar Magnetic Converter Using Dielectric Liquid Forced Convection Enabled by Additive Manufacturing
40/40 checkable references clean · checked 2026-09-24
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
17 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 40 checked references that resolve
resolves10.1109/ACCESS.2020.3021946
A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics
resolves10.1016/j.mattod.2014.04.003
Emerging challenges and materials for thermal management of electronics
resolves10.1109/TPEL.2021.3076532
Multiphysics Optimization of Thermal Management Designs for Power Electronics Employing Impingement Cooling and Stereolithographic Printing
resolves10.1016/j.energy.2021.120951
On the thermal management of a power electronics system: Optimization of the cooling system using genetic algorithm and response surface method
resolves10.3390/sym13081362
Nanofluids for the Next Generation Thermal Management of Electronics: A Review
resolves10.1109/TCPMT.2021.3085255
Materials and Interface Challenges in High-Vapor-Quality Two-Phase Flow Boiling Research
resolves10.1109/APEC.2019.8721971
An Interleaved 6-Level GaN Bidirectional Converter for Level II Electric Vehicle Charging
resolves10.1016/j.ijheatmasstransfer.2021.121033
Phase Change Material Heat Sink for Transient Cooling of High-Power Devices
resolves10.1109/TCPMT.2019.2930089
An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics
resolves10.1115/1.4047474
A System to Package Perspective on Transient Thermal Management of Electronics
resolves10.1109/ITHERM.2012.6231478
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
resolves10.1109/TMAG.2020.3027248
Soft Ferrite Material by Powder Injection Molding Process for Power Electronics
resolves10.1109/APEC42165.2021.9487180
Design of Planar Transformer for Dual Active Bridge for Renewable Energy Sources and Grid Integration Applications
resolves10.1109/TIE.2007.899877
A Practical Copper Loss Measurement Method for the Planar Transformer in High-Frequency Switching Converters
resolves10.1109/TIE.2010.2046005
Optimal Design and Tradeoff Analysis of Planar Transformer in High-Power DC–DC Converters
resolves10.1109/TIE.2008.2003102
A Coupled Electrothermal Model for Planar Transformer Temperature Distribution Computation
resolves10.1109/TCPMT.2021.3105003
Thermal Design, Optimization, and Packaging of Planar Magnetic Components
resolves10.1109/ITEC48692.2020.9161660
Electro-Thermal Co-Design of a Cooling System-Integrated High-Frequency Transformer
resolves10.1109/ITherm51669.2021.9503279
Two-Phase Immersion Cooling of Microprocessors with Electroplated Porous Heat Spreaders: Thermal Performance and Reliability
resolves10.1109/TCPMT.2015.2453273
Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems
resolves10.1016/j.ijheatmasstransfer.2019.118918
Water immersion cooling of high power density electronics
resolves10.1109/ITherm51669.2021.9503149
Two-Phase Closed-Loop Thermosyphon Filled with a Dielectric Liquid for Electronics Cooling Applications
resolves10.4236/aces.2016.63024
An Accurate and Computationally Efficient Explicit Friction Factor Model
resolves10.1016/j.ijheatmasstransfer.2020.119591
High power density thermal energy storage using additively manufactured heat exchangers and phase change material
resolves10.1109/TCPMT.2019.2936852
Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
resolves10.1016/j.joule.2021.08.004
Ultra-power-dense heat exchanger development through genetic algorithm design and additive manufacturing
resolves10.1016/j.cdc.2019.100244
Glass transition temperatures, melting temperatures, water contact angles and dimensional precision of simple fused deposition model 3D prints and 3D printed channels constructed from a range of commercially available filaments
resolves10.1115/1.4051059
Corrosion Study on Single-Phase Liquid Cooling Cold Plates With Inhibited Propylene Glycol/Water Coolant for Data Centers
resolves10.1007/s10854-021-05635-w
Thermal interface materials for cooling microelectronic systems: present status and future challenges
resolves10.1039/C9TC05415D
Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities
resolves10.1007/978-981-15-6360-7_35
CFD Analysis of Heat Transfer in Liquid-Cooled Heat Sink for Different Microchannel Flow Field Configuration
resolves10.1016/j.rser.2020.110566
Review of heat transfer enhancement techniques for single phase flows
resolves10.1021/acsanm.1c00524
Scalable and Resilient Etched Metallic Micro- and Nanostructured Surfaces for Enhanced Flow Boiling
resolves10.1016/j.ijheatmasstransfer.2012.06.027
Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility
The 17 references without a DOI — listed, not checked
no DOI — not checkedMicrochannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm$^2$ Heat Dissipation
no DOI — not checkedReduced Order Design Optimization of Liquid Cooled Heat Sinks
no DOI — not checkedElectro-Thermal-Control Co-Design of An All Silicon Carbide 2250 kW Dual-Inverter for Heavy-Duty Traction Applications
no DOI — not checkedPhase change material-based thermal energy storage
no DOI — not checkedThermal Modelling of Planar Transformers Considering Internal Power Loss Distribution
no DOI — not checkedPlanar transformer equivalent thermal resistance variation with ambient temperature and power losses
no DOI — not checkedJumping-droplet electronics hot-spot cooling
no DOI — not checkedref33
no DOI — not checkedref35
no DOI — not checkedref36
no DOI — not checkedref37
no DOI — not checkedA review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties
no DOI — not checkedref49
no DOI — not checkedref50
no DOI — not checkedref53
no DOI — not checkedReview of heat transfer enhancement techniques in two-phase flows for highly efficient and sustainable cooling
no DOI — not checkedDirect Waste Heat Utilization From Liquid-Cooled Supercomputers
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-09-24 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
Embed this badge
Both snippets point at the live badge image and link back to this page. The badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.
<a href="https://citestamp.com/citestamped/10.2139/ssrn.3986690"><img src="https://citestamp.com/citestamped/10.2139/ssrn.3986690/badge.svg" alt="CiteStamped reference-health badge" width="460" height="64"></a>
[](https://citestamp.com/citestamped/10.2139/ssrn.3986690)