Reference health
Facilely Synthesized Ag Nanoparticles Coated Cu Microparticle Interconnect Material for Bonding Bare Cu in the Air at Low Temperature
37/37 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
15 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 37 checked references that resolve
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Advancements in energy efficient<scp>GaN</scp>power devices and power modules for electric vehicle applications: a review
resolves10.1109/TIE.2021.3059544
High-Voltage Hybrid IGBT Power Modules for Miniaturization of Rolling Stock Traction Inverters
resolves10.1109/TDEI.2020.009041
Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs
resolves10.1016/j.paerosci.2021.100739
A road map for reliable power electronics for more electric aircraft
resolves10.1088/1361-6641/abde17
GaN FinFETs and trigate devices for power and RF applications: review and perspective
resolves10.1109/JESTPE.2019.2951801
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
resolves10.1016/S0927-796X(02)00007-4
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
resolves10.1016/j.ijrmhm.2016.09.004
Coarsening, densification, and grain growth during sintering of nano-sized powders—A perspective
resolves10.1016/j.ijheatmasstransfer.2018.06.083
Silver nanopaste: Synthesis, reinforcements and application
resolves10.1016/j.jsamd.2016.11.002
Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes
resolves10.1016/j.microrel.2013.07.103
Migration issues in sintered-silver die attaches operating at high temperature
resolves10.1016/j.matdes.2018.11.003
Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
resolves10.1021/acsami.6b10280
Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles
resolves10.1016/j.jmatprotec.2017.11.001
Improvement of oxidation resistance and bonding strength of Cu nanoparticles solder joints of Cu–Cu bonding by phosphating the nanoparticle
resolves10.1016/j.apsusc.2021.151220
Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition
resolves10.1039/C6RA16474A
Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air
resolves10.1016/j.ultsonch.2017.10.003
Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging
resolves10.1016/j.cej.2019.01.186
Room temperature sintering of Cu-Ag core-shell nanoparticles conductive inks for printed electronics
resolves10.1016/j.jmrt.2021.07.059
Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline
resolves10.1016/j.scriptamat.2018.02.029
Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles
resolves10.1016/j.matlet.2021.129781
Synthesis of highly antioxidant and low-temperature sintering Cu-Ag core–shell submicro-particles for high-power density electronic packaging
resolves10.1016/j.apsusc.2019.02.221
Dewetting behavior of Ag in Ag-coated Cu particle with thick Ag shell
resolves10.1016/j.jmatprotec.2018.03.005
Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints
resolves10.1021/acsami.5b01341
Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
resolves10.1179/174328008X353538
Densification and grain growth during sintering of nanosized particles
resolves10.1016/j.actamat.2004.11.029
Coarsening and grain growth in sintering of two particles of different sizes
resolves10.1016/j.apsusc.2012.08.066
Study on synthesis of ultrafine Cu–Ag core–shell powders with high electrical conductivity
resolves10.2320/matertrans.MD201222
Metal&ndash;Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
resolves10.1016/j.jallcom.2017.03.220
Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles
resolves10.1016/j.actamat.2018.09.069
Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics
resolves10.1016/j.actamat.2021.117182
Grain growth in sintering: A discrete element model on large packings
The 15 references without a DOI — listed, not checked
no DOI — not checkedref1
no DOI — not checkedref8
no DOI — not checkedref11
no DOI — not checkedPb-Free Die-Attach Materials
no DOI — not checkedref16
no DOI — not checkedComparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
no DOI — not checkedref20
no DOI — not checkedMorphological changes in sintered silver due to atomic migration, Die-Attach Mater
no DOI — not checkedref28
no DOI — not checkedEnhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects
no DOI — not checkedFabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics
no DOI — not checkedRapid sintering by thermo-compression in air using a paste containing bimodal-sized silver-coated copper particles and effects of particle size and surface finish type
no DOI — not checkedNanowire formation during catalyst assisted chemical vapor deposition
no DOI — not checkedref46
no DOI — not checkedref50
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