Reference health
Design Optimization and Performance Pareto Front Development of a Multi-Level 3d Manifolded Extreme Heat Flux Cooler Via Reduced Order Numerical Modeling
19/19 checkable references clean · checked 2026-07-23
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
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The 19 checked references that resolve
resolves10.1016/j.ijheatmasstransfer.2017.10.015
A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
resolves10.1038/s41586-020-2666-1
Co-designing electronics with microfluidics for more sustainable cooling
resolves10.1115/ICNMM2007-30190
Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices
resolves10.1115/1.4001306
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
resolves10.1016/j.ijheatmasstransfer.2012.07.073
Numerical investigation and sensitivity analysis of manifold microchannel coolers
resolves10.1109/ITherm45881.2020.9190541
Microfabrication Challenges for Silicon-based Large Area (>500 mm<sup>2</sup>) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal
resolves10.1109/ITherm45881.2020.9190179
Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications
resolves10.1016/j.ijheatmasstransfer.2014.10.022
Numerical modeling and thermal optimization of a single-phase flow manifold-microchannel plate heat exchanger
resolves10.1016/j.ijheatfluidflow.2010.03.001
A novel high performance, ultra thin heat sink for electronics
resolves10.1016/j.ijheatmasstransfer.2013.09.067
Manifold microchannel heat sink design using optimization under uncertainty
resolves10.1109/EPTC.1998.756010
Heat transfer and flow issues in manifold microchannel heat sinks: a CFD approach
resolves10.1142/S0960313199000088
INVESTIGATIVE STUDY OF MANIFOLD MICROCHANNEL HEAT SINKS FOR ELECTRONIC COOLING DESIGN
resolves10.1109/TCPMT.2013.2245943
Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model
resolves10.1016/S0017-9310(02)00443-X
Three-dimensional numerical optimization of a manifold microchannel heat sink
The 10 references without a DOI — listed, not checked
no DOI — not checkedref4
no DOI — not checkedref5
no DOI — not checkedA Micromachined Manifold Microchannel Cooler
no DOI — not checkedThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (?1 kW/cm2) Power Electronics Cooling
no DOI — not checkedEmbedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
no DOI — not checkedref18
no DOI — not checkedThermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
no DOI — not checkedA "2.5-D" modeling approach for single-phase flow and heat transfer in manifold microchannels
no DOI — not checkedref28
no DOI — not checkedNumerical Study of Large Footprint (24 x 24 mm 2 ) Silicon-Based Embedded Microchannel-3D Manifold Cooler
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