Reference health
Rapid Manufacturing of Diamond/Cu Composites Prepared Via Ultrasonic Consolidation
40/40 checkable references clean · checked 2026-07-22
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
6 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 40 checked references that resolve
resolves10.1016/j.compscitech.2005.05.027
Metal matrix composites – From science to technological significance
resolves10.1016/S1002-0071(12)60029-X
Review of metal matrix composites with high thermal conductivity for thermal management applications
resolves10.1016/j.jallcom.2019.03.347
Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materials
resolves10.1016/j.ceramint.2019.04.008
Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating
resolves10.1007/s10853-020-05443-3
High thermal conductive copper/diamond composites: state of the art
resolves10.1016/j.jmst.2021.03.018
Reinforcement size effect on thermal conductivity in Cu-B/diamond composite
resolves10.1016/j.matlet.2019.07.107
Effect of Ag/Cu matrix composition on thermal properties of diamond/Ag/Cu-Ti composites fabricated by pressureless sintering
resolves10.1016/j.msea.2006.12.146
Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications
resolves10.1016/j.carbon.2020.10.036
Unveiling the interface characteristics and their influence on the heat transfer behavior of hot-forged Cu–Cr/Diamond composites
resolves10.1016/j.scriptamat.2007.10.011
Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications
resolves10.1016/j.scriptamat.2007.08.007
On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites
resolves10.1016/j.apt.2019.08.022
Facile electroless copper plating on diamond particles without conventional sensitization and activation
resolves10.1016/j.apsusc.2017.01.078
Mo2C coating on diamond: Different effects on thermal conductivity of diamond/Al and diamond/Cu composites
resolves10.1016/j.applthermaleng.2013.05.038
Preparation of copper–diamond composites with chromium carbide coatings on diamond particles for heat sink applications
resolves10.1016/j.scriptamat.2018.04.021
Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface
resolves10.1016/j.scriptamat.2011.09.028
Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles
resolves10.1016/j.compscitech.2011.06.012
Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
resolves10.1016/j.matdes.2017.02.005
Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications
resolves10.1016/j.jallcom.2018.01.078
Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment
resolves10.1016/j.jallcom.2018.03.241
Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites
resolves10.1016/j.actamat.2018.09.004
Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond
resolves10.1016/j.matdes.2015.03.056
Diamond–tungsten based coating–copper composites with high thermal conductivity produced by Pulse Plasma Sintering
resolves10.1016/j.vacuum.2018.03.052
Optimized thermal conductivity of diamond/Cu composite prepared with tungsten-copper-coated diamond particles by vacuum sintering technique
resolves10.1016/j.vacuum.2022.111133
Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles
resolves10.1016/j.addma.2021.101927
Manufacturing of complex diamond-based composite structures via laser powder-bed fusion
resolves10.1016/j.jallcom.2009.10.040
Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles
resolves10.1016/j.compositesa.2016.10.005
Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration
resolves10.1016/j.matchar.2019.02.018
Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties
resolves10.1016/j.procir.2013.03.004
Ultrasonic Additive Manufacturing – A Hybrid Production Process for Novel Functional Products
resolves10.1108/13552540710776179
Use of ultrasonic consolidation for fabrication of multi‐material structures
resolves10.1007/s11663-008-9224-9
A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism
resolves10.1016/j.cirpj.2010.07.006
Development of Functionally Graded Materials by Ultrasonic Consolidation
resolves10.1016/j.jmatprotec.2013.05.008
A model to characterize acoustic softening during ultrasonic consolidation
resolves10.1016/j.apsusc.2015.04.022
Anisotropy of synthetic diamond in catalytic etching using iron powder
resolves10.1016/j.actamat.2017.04.062
Bimodal titanium alloys with ultrafine lamellar eutectic structure fabricated by semi-solid sintering
resolves10.1016/j.matchar.2015.06.023
Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method
resolves10.1016/j.diamond.2017.11.010
Theoretical modelling for interface design and thermal conductivity prediction in diamond/Cu composites
resolves10.1016/j.scriptamat.2009.12.040
Bonding characteristics during very high power ultrasonic additive manufacturing of copper
The 6 references without a DOI — listed, not checked
no DOI — not checkedref2
no DOI — not checkedStudy on surface modification of diamond particles and thermal conductivity properties of their reinforced metal-based (Cu or Mg) composites
no DOI — not checkedInterphase layer characteristics and thermal conductivity of hotforged Cu-B/diamond composites
no DOI — not checkedref22
no DOI — not checkedref23
no DOI — not checkedResearch progress of diamond/copper composites with high thermal conductivity
What this badge says. CiteStamped means the CHECKABLE references of this
work were clean at the dated check: each resolved to a known work in a public registry, and none
carried a retraction notice at that time. It says nothing about the quality, findings,
or importance of the work itself, and nothing about references deposited without a DOI.
checked 2026-07-22 — re-checked daily as this page is visited; titles and statuses come from Crossref and DataCite and are not part of the signed record
Embed this badge
Both snippets point at the live badge image and link back to this page. The badge re-renders from the daily check, so an embed never goes stale by more than a day of visits.
<a href="https://citestamp.com/citestamped/10.2139/ssrn.4150321"><img src="https://citestamp.com/citestamped/10.2139/ssrn.4150321/badge.svg" alt="CiteStamped reference-health badge" width="460" height="64"></a>
[](https://citestamp.com/citestamped/10.2139/ssrn.4150321)