Reference health
Study on the Electro-Thermal Coupling of Through Silicon Via and Heat Transfer Performance of Embedded Micro-Fin in a 3d Ic
19/19 checkable references clean · checked 2026-09-06
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
13 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 19 checked references that resolve
resolves10.1016/j.mee.2019.03.009
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
resolves10.1016/j.ijheatmasstransfer.2021.121332
A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks
resolves10.1016/j.ijheatmasstransfer.2021.121192
Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
resolves10.1109/TCPMT.2019.2933864
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
resolves10.1038/s41586-020-2666-1
Co-designing electronics with microfluidics for more sustainable cooling
resolves10.1016/j.ijheatmasstransfer.2020.120118
Heat transfer characteristics investigations on liquid-cooled integrated micro pin-fin chip with gradient distribution arrays and double heating input for intra-chip micro-fluidic cooling
resolves10.1016/j.ijthermalsci.2021.107109
Assessment of heat transfer and pressure drop of metal foam-pin-fin heat sink
resolves10.1109/TED.2018.2888870
Nonlinear Electrothermal Model for Investigating Transient Temperature Responses of a Through-Silicon Via Array Applied With Gaussian Pulses in 3-D IC
resolves10.1109/TCPMT.2019.2893323
An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits With Through-Silicon Vias
resolves10.1109/TED.2020.3048919
2-D-Nonlinear Electrothermal Model for Investigating the Self-Heating Effect in GAAFET Transistors
resolves10.1109/TED.2020.3036574
Signal and Thermal Integrity Analysis of 3-D Stacked Resistive Random Access Memories
resolves10.1109/TCPMT.2020.3006784
Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water
resolves10.1109/TCPMT.2021.3135558
Modeling of the RF Coaxial TSV Configuration Inside the Silicon Interposer With Embedded Cooling Cavity
resolves10.1109/TED.2013.2244895
Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers
resolves10.1109/TED.2010.2045676
Multiphysics Characterization of Transient Electrothermomechanical Responses of Through-Silicon Vias Applied With a Periodic Voltage Pulse
resolves10.1115/1.4003284
Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
resolves10.1016/0017-9310(80)90177-5
Forced convection heat transfer in helically rib-roughened tubes
resolves10.1016/j.applthermaleng.2015.08.105
Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling
resolves10.1016/j.expthermflusci.2017.01.005
Experimental investigation and empirical correlations of single and laminar convective heat transfer in microchannel heat sinks
The 13 references without a DOI — listed, not checked
no DOI — not checkedMoore's Law for Packaging to Replace Moore's Law for ICS
no DOI — not checkedAdvancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors
no DOI — not checkedLow-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration
no DOI — not checkedThermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review
no DOI — not checkedEffects of geometric parameters of circular pin-fins on fluid flow and heat transfer in an interrupted microchannel heat sink
no DOI — not checkedEffects of truncated and offset pin-fins on hydrothermal performance and entropy generation in a rectangular microchannel heat sink with variable fluid properties
no DOI — not checkedCoupling management optimization of temperature and thermal stress inside 3D-IC with multi-cores and various power density
no DOI — not checkedA novel thermal management scheme for 3D-IC chips with multi-cores and high power density
no DOI — not checkedThermal management of 3D chip with nonuniform hotspots by integrated gradient distribution annular-cavity micro-pin fins
no DOI — not checkedNumerical investigation on the characteristics of flow and heat transfer enhancement by micro pin-fin array heat sink with fin-shaped strips
no DOI — not checkedThree-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures
no DOI — not checkedHeterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies
no DOI — not checkedFluid flow and heat transfer characteristics of microchannel heat sinks with different groove shapes
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