Reference health
High-Frequency 5g Substrate: Low Dielectric Biphenyl Polyimide with Low Cte and High Thermal Stability
23/23 checkable references clean · checked 2026-07-25
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
30 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 23 checked references that resolve
resolves10.1016/j.actamat.2013.03.032
Formation of conductive and reflective silver nanolayers on plastic films via ion doping and solid–liquid interfacial reduction at ambient temperature
resolves10.1016/S0032-3861(00)00881-8
Effect of film thickness on the electrical properties of polyimide thin films
resolves10.1039/D1EE03186D
High-temperature polyimide dielectric materials for energy storage: theory, design, preparation and properties
resolves10.1088/0957-0233/18/9/016
Non-destructive complex permittivity measurement of low permittivity thin film materials
resolves10.1039/D3TC02933F
Enhancing optical, dielectric, and thermal properties of bio-based polyimides incorporating isomannide with a bent and sterically constrained conformation
resolves10.1016/j.mssp.2022.107232
Influence of heat treatment on H2S gas sensing features of NiO thin films deposited via thermal evaporation technique
resolves10.1016/j.clay.2009.11.010
Synthesis and characterization of transparent copolyimide films containing CF3 groups: Comparison with copolyimide nanocomposites
resolves10.2174/1385272823666190422130917
Benzoxazine Based High Performance Materials with Low Dielectric Constant: A Review
resolves10.1016/j.eurpolymj.2021.110369
Ultrahigh thermal-stability polyimides with low CTE and required flexibility by formation of hydrogen bonds between poly(amic acid)s
resolves10.3390/nano13142090
Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review
resolves10.1039/D2PY00550F
Perfluorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss
resolves10.1016/j.compscitech.2017.02.002
Imparting low dielectric constant and high modulus to polyimides via synergy between coupled silsesquioxanes and crown ethers
resolves10.1021/acssensors.3c01321
Insights into Selective Mechanism of NiO-TiO<sub>2</sub> Heterojunction to H<sub>2</sub> and CO
resolves10.1016/j.apsusc.2018.01.132
Low dielectric constant and moisture-resistant polyimide aerogels containing trifluoromethyl pendent groups
resolves10.1021/acsami.2c21463
Metal-Decorated InN Monolayer Senses N<sub>2</sub> against CO<sub>2</sub>
resolves10.1021/acsami.0c09321
Flexible Polyimide Aerogels with Dodecane Links in the Backbone Structure
resolves10.1002/ppap.201900039
Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects
resolves10.1002/pi.5979
Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers
resolves10.1007/s10971-023-06143-5
Methods and strategies to decrease the dielectric properties of polyimide films: a review
resolves10.1016/j.eurpolymj.2023.112544
Polyimide films with ultralow dielectric loss for 5G applications: Influence and mechanism of ester groups in molecular chains
The 30 references without a DOI — listed, not checked
no DOI — not checkedref1
no DOI — not checkedref2
no DOI — not checkedProgress in low dielectric polyimide film-A review
no DOI — not checkedCompact dual-band millimeter-wave antenna for 5G WLAN
no DOI — not checkedPreparation and characterization of low CTE thermoplastic copolyimide resins based on the structural design of block sequence
no DOI — not checkedThe "fluorine impact" on dielectric constant of polyimides: A molecular simulation study
no DOI — not checkedPreparation and properties of a fluorinated epoxy resin with low dielectric constant
no DOI — not checkedAPDS modified several bisphenol A polyimides with low dielectric constant under high frequency
no DOI — not checkedref13
no DOI — not checkedMechanical enhancement and dielectric properties of SiO2 contained polyimides under high frequency
no DOI — not checkedref16
no DOI — not checkedSyntheses of colorless and transparent polyimide membranes for microfiltration
no DOI — not checkedref19
no DOI — not checkedref21
no DOI — not checkedA surface modification of KTa0. 5Nb0. 5O3 by APDS and its enhanced dielectric properties for polyimide nanocomposites
no DOI — not checkedSynthesis and characterization of high fluorine-containing polyimides with low-dielectric constant
no DOI — not checkedPerformance of high-temperature thermosetting polyimide composites modified with thermoplastic polyimide
no DOI — not checkedSynthesis and Properties Comparison of Low Dielectric Silicon Containing Polyimides
no DOI — not checkedEnhancing the Dielectric Properties of Polyimide-based Composites with Donor-doped SiO2
no DOI — not checkedClosed-cell rigid polyimide foams for high-temperature applications: The effect of structure on combined properties
no DOI — not checkedTwin evolution and work-hardening phenomenon of a bulk ultrafine grained copper with high thermal stability and strength-ductility synergy
no DOI — not checkedLow-dielectric polyimide constructed by integrated strategy containing main-chain and crosslinking network engineering
no DOI — not checkedStructure-property relationship of low dielectric constant polyimide fibers containing fluorine groups
no DOI — not checkedPolyimide film containing sulfone groups with high dielectric properties
no DOI — not checkedResearch progress on porous low dielectric constant materials
no DOI — not checkedMolecular dynamics simulation study on the structure and properties of polyimide/silica hybrid materials
no DOI — not checkedDFT and molecular dynamic simulation for the dielectric property analysis of polyimides
no DOI — not checkedHigh thermally stable and melt processable polyimide resins based on phenylethynyl-terminated oligoimides containing siloxane structure
no DOI — not checkedReducing the Permittivity of Polyimides for Better Use in Communication Devices
no DOI — not checkedLow dielectric post-cured benzocyclobutene-functionalized fluorinecontaining polyimide material
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