Reference health
Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow
54/54 checkable references clean · checked 2026-07-24
Every reference with a DOI in the deposited reference list resolved to a known work in Crossref or DataCite at the dated check, and none carried a retraction, withdrawal, or removal notice.
14 without a DOI — not checked. A reference deposited without a DOI is never matched by title or guessed at; it stays outside the checked set, and this line discloses that.
The 54 checked references that resolve
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Locally heated shear-driven liquid films in microchannels and minichannels
resolves10.1016/j.ijheatmasstransfer.2012.07.080
Experimental investigation and flow visualization to determine the optimum dimension range of microgap heat sinks
resolves10.1016/j.applthermaleng.2011.10.021
CO2 and R410A: Two-phase flow visualizations and flow boiling measurements at medium (0.50) reduced pressure
resolves10.1016/j.ijmultiphaseflow.2003.09.004
Forced convective boiling heat transfer in microtubes at low mass and heat fluxes
resolves10.1080/01457630802656678
Modeling and Prediction of Two-Phase Microgap Channel Heat Transfer Characteristics
resolves10.1016/j.ijmultiphaseflow.2012.02.007
Experimental investigation of local flow boiling heat transfer and pressure drop characteristics in microgap channel
resolves10.1080/01457632.2014.932548
Thermal Characteristics of a Chip-Scale Two-Phase Microgap Cooler
resolves10.1615/IHTC15.eec.009808
Liquid Film Wave Patterns and Dryout in Microgap Channel Annular Flow
resolves10.1016/j.expthermflusci.2010.08.001
Evaporation and flow dynamics of thin, shear-driven liquid films in microgap channels
resolves10.1109/ITHERM.2012.6231546
Two-phase microgap cooling of a thermally-simulated microprocessor chip
resolves10.1109/ITHERM.2017.7992511
Embedded two-phase cooling of high heat flux electronics on silicon carbide (SiC) using thin-film evaporation and an enhanced delivery system (FEEDS) manifold-microchannel cooler
resolves10.1016/j.ijmultiphaseflow.2010.09.002
Characterization and prediction of two-phase flow regimes in miniature tubes
resolves10.1080/18811248.1983.9733489
Flow Behavior and Phase Distribution in Two-Phase Flow around Inverted U-Bend
resolves10.1016/j.ijrefrig.2012.02.002
Two-phase flow patterns in U-bends and their contiguous straight tubes for different orientations, tube and bend diameters
resolves10.1615/InterfacPhenomHeatTransfer.2016016238
THERMOFLUID CHARACTERISTICS OF HIGH-QUALITY FLOWIN CHIP-SCALE MICROGAP CHANNELS
resolves10.1016/j.ijmultiphaseflow.2016.03.016
Waves and instabilities in high quality adiabatic flow in microgap channels
resolves10.1109/ITHERM.2017.7992474
Two-phase flow regimes in a U-shaped diabatic manifolded-microgap channel
resolves10.1016/j.expthermflusci.2012.09.012
Unified mechanistic multiscale mapping of two-phase flow patterns in microchannels
resolves10.1115/IPACK2017-74287
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel
resolves10.1016/0735-1933(92)90061-L
Identification of the range of ‘small diameters’ conduits, regarding two-phase flow pattern transitions
resolves10.1016/j.expthermflusci.2010.08.004
Macro-to-microchannel transition in two-phase flow: Part 1 – Two-phase flow patterns and film thickness measurements
resolves10.1016/S0301-9322(98)00054-8
Gas–liquid two-phase flow in microchannels Part I: two-phase flow patterns
resolves10.1016/j.ijheatmasstransfer.2010.02.039
A comprehensive flow regime map for microchannel flow boiling with quantitative transition criteria
resolves10.1016/S1359-4311(96)00071-3
Correlations for the prediction of boiling heat transfer in small-diameter channels
resolves10.1080/01457632.2015.972726
Flow Boiling Phenomenological Differences Between Micro- and Macroscale Channels
resolves10.1109/TED.2015.2480756
Low-Temperature Bonded GaN-on-Diamond HEMTs With 11 W/mm Output Power at 10 GHz
resolves10.1109/LEC.2014.6951557
S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates
resolves10.1063/1.4796168
Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance
resolves10.1109/ITHERM.2010.5501254
Heat-removal performance scaling of interlayer cooled chip stacks
resolves10.1109/ITHERM.2017.7992509
Microfluidic two-phase cooling of a high power microprocessor part A: Design and fabrication
resolves10.1109/ITHERM.2017.7992510
Microfluidic two-phase cooling of a high power microprocessor part B: Test and characterization
resolves10.1115/1.4023898
Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm
resolves10.1016/S0894-1777(02)00150-4
Fundamental issues related to flow boiling in minichannels and microchannels
resolves10.1109/COMCAS.2015.7360498
Near-junction microfluidic thermal management of RF power amplifiers
resolves10.1115/1.3097347
Fluid Flow and Heat Transfer at Micro- and Meso-Scales With Application to Heat Exchanger Design
resolves10.1021/i260019a023
Correlation for Boiling Heat Transfer to Saturated Fluids in Convective Flow
resolves10.1016/j.ijthermalsci.2009.12.016
Scale effects on flow boiling heat transfer in microchannels: A fundamental perspective
The 14 references without a DOI — listed, not checked
no DOI — not checkedFlow boiling heat transfer and flow pattern in rectangular channel of mini-gap
no DOI — not checkedExperiments on dominant force regimes in flow boiling using mini-tubes
no DOI — not checkedCapillary hydrostatics and hydrodynamics at low g
no DOI — not checkedFlow pattern transition in two phase flow
no DOI — not checkedCo-design modeling for 3D chip stacks
no DOI — not checkedDie-level embedded cooling & thermal isolation in 2.5D/3D ICs and electrical benchmarking
no DOI — not checkedDevelopment of a diamond microfluidics-based intra-chip cooling technology for GaN
no DOI — not checkedNear Junction Thermal Transport (NJTT)
no DOI — not checkedIntrachip/Interchip Enhanced Cooling Applications (ICECool Applications)
no DOI — not checkedIntrachip/Interchip Enhanced Cooling Fundamentals (ICECool Fundamentals)
no DOI — not checkedThermal packaging - from problem solver to performance multiplier
no DOI — not checkedref47
no DOI — not checkedA new correlation for heat transfer during boiling flow through pipes
no DOI — not checkedChart correlation for saturated boiling heat transfer: Equations and further study
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